IP Library Granted Patent US 8,558,235
Granted Patent B2
US 8,558,235 · App. 13/036,502 · Granted Oct 15, 2013

Organic light emitting diode display and manufacturing method thereof

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Quick Facts
Patent No.
US 8,558,235
App. No.
13/036,502
Granted
Oct 15, 2013
Kind
B2
Abstract

An organic light emitting diode (OLED) display that includes a substrate, a thin film transistor, and a pixel electrode. The thin film transistor is formed on the substrate and includes a semiconductor layer, a gate electrode, a source electrode, and a drain electrode. The pixel electrode is electrically connected to the thin film transistor and is formed on the same layer as the source electrode and the drain electrode. The source electrode and the drain electrode include a first conductive layer, and the pixel electrode includes a first conductive layer and a second conductive layer stacked thereon.

Claims (41)

1. An organic light emitting diode display, comprising:

a substrate;

a thin film transistor formed on the substrate and including a semiconductor layer, a gate electrode, a source electrode, and a drain electrode; and

a pixel electrode electrically connected to the thin film transistor and formed on the same layer as the source electrode and the drain electrode; wherein

the source electrode and the drain electrode include a first conductive layer, and the pixel electrode includes the first conductive layer and a second conductive layer stacked on the first conductive layer, the source electrode and the drain electrode do not include the second conductive layer.

2. The organic light emitting diode display of claim 1 , wherein the semiconductor layer is formed on the substrate, a gate insulation layer is formed while covering the semiconductor layer, the gate electrode is formed in a channel region of the semiconductor layer with the gate insulation layer therebetween, an inter-layer insulation layer is formed while covering the gate electrode, and the source electrode, the drain electrode, and the pixel electrode are formed on the inter-layer insulation layer.

3. The organic light emitting diode display of claim 1 , wherein the source electrode and the drain electrode are configured by the first conductive layer.

4. The organic light emitting diode display of claim 1 , wherein the first conductive layer includes at least one of aluminum, copper, molybdenum, titanium, titanium nitride, and alloys thereof.

5. The organic light emitting diode display of claim 4 , wherein the first conductive layer is formed by sequentially stacking a first titanium layer, an aluminum layer, and a second titanium layer.

6. The organic light emitting diode display of claim 1 , wherein the second conductive layer includes at least one of a transparent conductive material, silver, aluminum, titanium, nickel, and alloys thereof.

7. The organic light emitting diode display of claim 6 , wherein the second conductive layer is formed by sequentially stacking a first indium tin oxide (ITO) layer, a silver layer, and a second indium tin oxide layer.

8. A method for manufacturing an organic light emitting diode display including a substrate, a thin film transistor formed on the substrate and including a semiconductor layer, a gate electrode, a source electrode, and a drain electrode, and a pixel electrode electrically connected to the thin film transistor and formed on the same layer as the source electrode and the drain electrode, wherein, when the source electrode, the drain electrode, and the pixel electrode are formed, the source electrode and the drain electrode are formed with a first conductive layer on the substrate, and the pixel electrode is formed with the first conductive layer and a second conductive layer stacked on the first conductive layer, the source electrode and the drain electrode do not include the second conductive layer.

9. The method of claim 8 , wherein the method includes, before the forming of the source electrode, the drain electrode, and the pixel electrode, comprising:

forming the semiconductor layer on the substrate;

forming a gate insulation layer while covering the semiconductor layer;

forming the gate electrode in a channel region of the semiconductor layer with the gate insulation layer therebetween;

forming an inter-layer insulation layer while covering the gate electrode; and

forming a contact hole for revealing a source region and a drain region of the semiconductor layer on the inter-layer insulation layer and the gate insulation layer; and

the forming of the source electrode, the drain electrode, and the pixel electrode includes:

forming the first conductive layer on the inter-layer insulation layer to contact the source region and the drain region of the semiconductor layer through the contact holes;

forming the second conductive layer on the first conductive layer; and

patterning the first conductive layer and the second conductive layer.

10. The method of claim 9 , wherein the patterning of the first conductive layer and the second conductive layer uses a photosensitive layer pattern formed by halftone exposure.

11. The method of claim 10 , wherein the photosensitive layer pattern corresponds to a part in which the source electrode and the drain electrode will be formed, and includes a first part having a first thickness, a second part corresponding to a part in which the pixel electrode will be formed and having a second thickness that is thinner than the first part, and a third part for exposing the second conductive layer.

12. The method of claim 11 , wherein the patterning of the first conductive layer and the second conductive layer includes:

forming the photosensitive layer pattern on the second conductive layer;

etching and removing the first conductive layer and the second conductive layer corresponding to the third part;

removing a photosensitive layer pattern of the second part; and

etching and removing the second conductive layer corresponding to the second part.

13. The method of claim 8 , wherein the first conductive layer includes at least one of aluminum, copper, molybdenum, titanium, titanium nitride, and alloys thereof.

14. The method of claim 13 , wherein the first conductive layer is formed by sequentially stacking a first titanium layer, an aluminum layer, and a second titanium layer.

15. The method of claim 8 , wherein the second conductive layer includes at least one of a transparent conductive material, silver, aluminum, titanium, nickel, and alloys thereof.

16. The method of claim 15 , wherein the second conductive layer is formed by sequentially stacking a first indium tin oxide layer, a silver layer, and a second indium tin oxide layer.

17. An organic light emitting diode display, comprising:

a substrate;

a thin film transistor formed on the substrate and including a semiconductor layer, a gate electrode, a source electrode, and a drain electrode; and

a pixel electrode electrically connected to the thin film transistor and formed on the same layer as the source electrode and the drain electrode,

wherein the source electrode and the drain electrode include a first conductive layer, and the pixel electrode includes said first conductive layer and a second conductive layer stacked on the first conductive layer, said second conductive layer is transparent and has greater electrical conductivity characteristics than the first conductive layer, the source electrode and the drain electrode do not include the second conductive layer.

18. The organic light emitting diode display of claim 17 , wherein the semiconductor layer is formed on the substrate, a gate insulation layer is formed while covering the semiconductor layer, the gate electrode is formed in a channel region of the semiconductor layer with the gate insulation layer therebetween, an inter-layer insulation layer is formed while covering the gate electrode, and the source electrode, the drain electrode, and the pixel electrode are formed on the inter-layer insulation layer.

19. The organic light emitting diode display of claim 18 , wherein the source electrode and the drain electrode are configured by the first conductive layer.

20. The organic light emitting diode display of claim 1 , wherein the first conductive layer includes at least one of aluminum, copper, molybdenum, titanium, titanium nitride, and alloys thereof, and wherein the second conductive layer includes at least one of a transparent conductive material, silver, aluminum, titanium, nickel, and alloys thereof.

Assignments (2)
MERGER Recorded Sep 21, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029087/0636 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2011
From: YOON, JU-WON; LEE, IL-JEONG; IM, CHOONG-YOUL; KIM, YOUNG-DAE; YEO, JONG-MO; KWON, DO-HYUN; YU, CHEOL-HO
To: SAMSUNG MOBILE DISPLAY CO., LTD., A CORPORATION CHARTERED IN AND EXISTING UNDER THE LAW OF THE REPUBLIC OF KOREA
Reel/Frame 026087/0668 →