Lens device attachment to printed circuit board
An optical assembly can be formed by providing a frame made of a plastic material on a surface of a printed circuit board (PCB), mounting at least one opto-electronic element on the surface of the PCB within the frame, and laser-welding a lens device onto the frame.
1. A method for making an optical assembly, comprising:
providing a frame made of a plastic material on a surface of a printed circuit board (PCB), the frame having a generally planar shape, an interior region, and a continuous perimeter with a flat surface extending in a plane around the interior region;
mounting at least one opto-electronic device on the surface of the PCB within the interior region of the frame using one or more optically detected points of reference on the PCB;
placing a lens device on the frame by moving the lens device into alignment with the opto-electronic device using the one or more optically detected points of reference on the PCB, a flat base portion of the lens device contacting the flat surface of the frame, contact between the flat base portion of the lens and the flat surface of the frame not restricting planar movement of the lens device with respect to the frame during alignment, the lens device having at least one optical element for optically coupling an optical fiber to the opto-electronic device; and
laser-welding the lens device to the frame after the lens device has been moved into alignment with the opto-electronic device.
2. The method claimed in claim 1 , wherein providing a frame comprises overmolding the frame onto the surface of the PCB.
3. The method claimed in claim 1 , wherein providing a frame comprises mounting the frame to the surface of the PCB.
4. The method claimed in claim 1 , wherein:
mounting at least one opto-electronic device comprises aligning the opto-electronic device using one or more fiducials on the PCB as the one or more optically detected points of reference; and
placing the lens device on the frame comprises aligning the lens device using the one or more fiducials on the PCB as the one or more optically detected points of reference.
5. The method claimed in claim 4 , wherein:
mounting at least one opto-electronic device comprises using a pick-and-place machine to mount the at least one opto-electronic device by the pick-and-place machine using the one or more fiducials on the PCB as the one or more optically detected points of reference; and
placing the lens device on the frame comprises using the pick-and-place machine to place the lens device on the frame by the pick-and-place machine using the one or more fiducials on the PCB as the one or more optically detected points of reference.
6. The method claimed in claim 5 , wherein laser-welding the lens device to the frame comprises using a laser-welder mounted on the pick-and-place machine to weld the lens device to the frame while the pick-and-place machine holds the lens device in place on the frame at the location of placing the lens device.
7. The method claimed in claim 1 , wherein laser-welding the lens device to the frame comprises forming a continuous weld corresponding to the perimeter.
8. The method claimed in claim 1 , wherein laser-welding the lens device to the frame comprises directing a laser-welding beam at an exterior surface of the lens device along an axis intersecting the flat base portion of the lens device and the flat surface of the frame in contact with the flat base portion of the lens device.
9. The method claimed in claim 1 , wherein laser-welding the lens device to the frame comprises directing a laser beam through portions of the lens device substantially transparent to the laser beam onto portions of the frame substantially opaque to the laser beam.
10. The method claimed in claim 9 , wherein laser-welding the lens device to the frame comprises forming a continuous weld corresponding to the perimeter.
11. The method claimed in claim 7 , wherein laser-welding the lens device to the frame comprises forming a plurality of spot welds prior to forming the continuous weld.
12. The method claimed in claim 1 , wherein the lens device includes a reflector, a lens, and a fiber port adapted to receive an end of an optical fiber, the reflector defining first and second optical paths, the first optical path extending between the opto-electronic device and the reflector, and the second optical path extending between the reflector and the fiber port, the fiber port having an optical axis parallel to the surface of the PCB.
13. A method for making an optical assembly, comprising:
providing a frame made of a plastic material on a surface of a printed circuit board (PCB), the frame having a generally planar shape, an interior region, and a continuous perimeter with a flat surface extending in a plane around the interior region;
mounting at least one opto-electronic device on the surface of the PCB within the interior region of the frame using one or more fiducial markings on the PCB as optically detected points of reference;
placing a lens device on the frame by moving the lens device into alignment with the opto-electronic device using one or more fiducial markings on the PCB as optically detected points of reference, a flat base portion of the lens device contacting the flat surface of the frame, contact between the flat base portion of the lens and the flat surface of the frame not restricting planar movement of the lens device with respect to the frame during alignment, the lens device having a reflector, a lens, and a fiber port adapted to receive an end of an optical fiber, the reflector defining first and second optical paths, the first optical path extending between the opto-electronic device and the reflector, and the second optical path extending between the reflector and the fiber port, the fiber port having an optical axis parallel to the surface of the PCB; and
laser-welding the lens device to the frame after the lens device has been moved into alignment with the opto-electronic device by directing a laser beam through portions of the lens device substantially transparent to the laser beam onto portions of the frame substantially opaque to the laser beam.
14. The method of claim 13 , wherein providing a frame comprises overmolding the frame onto the surface of the PCB.
15. The method of claim 13 , wherein providing a frame comprises mounting the frame to the surface of the PCB.
16. The method of claim 13 , wherein placing the lens device on the frame comprises using a pick-and-place machine to place the lens device on the frame by the pick-and-place machine using the one or more fiducials on the PCB as the one or more optically detected points of reference.
17. The method of claim 13 , wherein laser-welding the lens device to the frame comprises using a laser-welder mounted on the pick-and-place machine to weld the lens device to the frame.
18. The method of claim 17 , wherein laser-welding the lens device to the frame further comprises the pick-and-place machine holding the lens device in place on the frame at the location of placing the lens device while the laser-welder mounted on the pick-and-place machine welds the lens device to the frame.
19. The method of claim 13 , wherein laser-welding the lens device to the frame comprises forming a continuous weld corresponding to the perimeter.
20. The method of claim 19 , wherein laser-welding the lens device to the frame further comprises forming a plurality of spot welds prior to forming the continuous weld.