Semiconductor devices and methods of manufacturing the same
Provided are a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes a charge storage pattern formed on a substrate; a dielectric pattern formed on the charge storage pattern; a first conductive pattern including silicon doped with a first impurity of a first concentration, the first conductive pattern being disposed on the dielectric pattern; and a second conductive pattern including metal silicide doped with a second impurity of a second concentration, the second conductive pattern being disposed on the first conductive pattern. The first concentration may be higher than the second concentration.
1. A semiconductor device, comprising:
a charge storage pattern formed on a substrate;
a dielectric pattern formed on the charge storage pattern;
a first conductive pattern including silicon doped with a first impurity of a first concentration, the first conductive pattern being disposed on the dielectric pattern; and
a second conductive pattern including metal silicide doped with a second impurity of a second concentration, the second conductive pattern being disposed on the first conductive pattern,
wherein the first concentration is higher than the second concentration.
2. The semiconductor device of claim 1 , wherein the first and second impurities comprise carbon (C), oxygen (O), nitrogen (N), germanium (Ge), arsenic (As), boron (B), fluorine (F) or combinations thereof.
3. The semiconductor device of claim 1 , wherein the first concentration is about ten times through about thirty times as high as the second concentration.
4. The semiconductor device of claim 1 , wherein the second conductive pattern comprises cobalt silicide (CuSi x ), nickel silicide (NiSi x ), molybdenum silicide (MoSi x ), titanium silicide (TiSi x ), tantalum silicide (TaSi x ) or combinations thereof.
5. The semiconductor device of claim 1 , further comprising a third conductive pattern including silicon doped with a third impurity of a third conductive pattern between the dielectric pattern and the first conductive pattern,
wherein the third concentration is lower than the first concentration and the third impurity comprises carbon (C), oxygen (O), nitrogen (N), germanium (Ge), arsenic (As), boron (B), fluorine (F) or combinations thereof.
6. The semiconductor device of claim 1 , further comprising a fourth conductive pattern including silicon doped with a fourth impurity of fourth concentration between the first conductive pattern and the second conductive pattern, wherein the fourth concentration is substantially lower than the first concentration and the fourth impurity comprises carbon (C), oxygen (O), nitrogen (N), germanium (Ge), arsenic (As), boron (B), fluorine (F) or combinations thereof.
7. The semiconductor device of claim 1 , when the number of unit cells including the charge storage pattern, the dielectric pattern, the first conductive pattern and the second conductive pattern is two or more, further comprising an interlayer insulating layer filling a space between the unit cells,
wherein a top surface of the interlayer insulating layer is lower than a top surface of the first conductive pattern.
8. The semiconductor device of claim 1 , wherein the charge storage pattern is a floating gate.
9. The semiconductor device of claim 1 , wherein the charge storage pattern is a charge trap layer and the dielectric pattern is a blocking insulating layer.