Encapsulant materials and associated devices
View Patent ↗Compositions suitable for use as encapsulants are described. The inventive compositions include a high molecular weight polymeric material, a curing agent, an inorganic compound, and a coupling agent. Optional elements include adhesion promoting agents, colorants, antioxidants, and UV absorbers. The compositions have desirable diffusivity properties, making them suitable for use in devices in which a substantial blocking of moisture ingress is desired, such as photovoltaic (PV) modules.
1. A composition which, when applied to a substrate and cured, provides a substantially water impervious coating on the substrate, the composition comprising:
an ethylene-propylene high molecular weight polymeric material in an amount from about 40% to about 95% by weight of the total composition;
an effective amount of a curing agent;
an inorganic compound;
an effective amount of a coupling agent; and
an antioxidant comprising one or more hindered-amine light stabilizers in an amount up to about 3% by weight of the total composition.
2. The composition of claim 1 , wherein the ethylene-propylene high molecular weight polymeric material is present in the composition in an amount from about 60% to about 80% by weight of the total composition.
3. The composition of claim 1 , wherein the ethylene-propylene high molecular weight polymeric material is present in the composition in an amount of about 65% by weight of the total composition.
4. The composition of claim 1 , wherein the ethylene-propylene high molecular weight polymeric material is a randomly polymerized mixture of individual units of ethylene and propylene.
5. The composition of claim 4 , wherein the ethylene-propylene high molecular weight polymeric material is terpolymerized with at least one diene molecule to form an ethylene-propylene-diene molecule.
6. The composition of claim 5 , wherein the diene molecule is selected from the group consisting of ethylidene nobornene, dicyclopentadiene, butadiene, 1,4hexadiene and combinations thereof.
7. The composition of claim 1 , wherein the effective amount of the curing agent is in an amount from about 0.1 to about 3% by weight of the total composition.
8. The composition of claim 1 , where the curing agent is a radical producing curing agent.
9. The composition of claim 8 , wherein the radical producing curing agent is a peroxide.
10. The composition of claim 8 , wherein the radical producing curing agent is an azide.
11. The composition of claim 1 , wherein the inorganic compound is present in the composition in an amount of from about 1% to about 25% by weight of the total composition.
12. The composition of claim 1 , wherein the composition further comprises an adhesion promoting agent in an amount from about 0.05% to about 2% by weight of the total composition.
13. The composition of claim 12 , where the adhesion promoting agent is an unsaturated alkoxy silane.
14. The composition of claim 12 , wherein the adhesion promoting agent is an alkoxy silane selected from the group consisting of bis-trialkoxy silanes, amino-alkoxy silanes, phenyl alkoxy silanes, methoxy alkyl silanes, ethoxy alkyl silanes, and combinations thereof.
15. The composition of claim 1 , further comprising an effective amount of a coupling coagent.
16. The composition of claim 15 , wherein the coupling coagent is present in the composition in an amount up to about 30% by weight of the total composition.
17. The composition according to claim 1 , wherein the coupling agent comprises a diacrylate.
18. The composition of claim 1 , wherein each of the one or more hindered-amine light stabilizers is selected from the group consisting of Tinuvin 770 [bis(2,2,6,6-tetramethyl-4-piperidinyl)sebacate], Chimassorb 944 {Poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-s-triazine-2,4-diyl]-[(2,2-,6,6-tetramethyl-4-piperidyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidyl)iminolli, Tinuvin 123 [Decanedioic acid, bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl)ester], Chimassorb 119 {1,3,5-Triazine-2,4,6-triamine,N,N′″-[1,2-ethanediylbis[[[4.6-bis[butyl(-1,2,2,6,6-pentamethyl-4-piperidinyl)amino]-1,3,5-triazine-2-yl]imino]-3,1p-ropanediyl]]-bis[N′,N″-dibutyl-N′,N″-bis(1,2,2,6,6-pentamethyl-4-piperid-inyl)-}, and combinations thereof.
19. A composition which, when applied to a substrate and cured, provides a substantially water impervious coating on the substrate, the composition comprising:
an ethylene-propylene high molecular weight polymeric material in an amount from about 40% to about 95% by weight of the total composition;
a curing agent in an amount from about 0.1% to about 3% by weight of the total composition;
an inorganic compound in an amount up to about 35% by weight of the total composition;
a coupling agent in an amount from about 0.09% to about 5% by weight of the total composition;
a processing aid in an amount up to about 50% by weight of the total composition;
an adhesion promoting agent in an amount from about 0.05% to about 2% by weight of the total composition; and
an antioxidant comprising one or more hindered-amine light stabilizers in an amount up to about 3% by weight of the total composition.
20. A composition which, when applied to a substrate and cured, provides a substantially water impervious coating on the substrate, the composition comprising:
a high molecular weight polymeric material comprising an ethylene-propylene-diene molecule in an amount from about 40% to about 95% by weight of the total composition;
a curing agent in an amount from about 0.1% to about 3% by weight of the total composition;
an inorganic compound in an amount up to about 35% by weight of the total composition;
a coupling agent in an amount from about 0.09% to about 5% by weight of the total composition;
a processing aid in an amount up to about 50% by weight of the total composition;
an adhesion promoting agent in an amount from about 0.05% to about 2% by weight of the total composition; and
an antioxidant comprising one or more hindered-amine light stabilizers in an amount up to about 3% by weight of the total composition.