Pattern forming method, processing method, and processing apparatus
View Patent ↗According to the embodiments, a distribution of a recess portion shape is calculated based on a result obtained by measuring the recess portion shape of a first projection and recess pattern formed on a surface of a template. Next, a distribution of an application amount of a curing agent to a processing target layer is calculated based on the distribution of the recess portion shape, and the curing agent is applied to the processing target layer based on this distribution of the application amount of the curing agent. Next, a second projection and recess pattern is formed by transferring the first projection and recess pattern onto the curing agent by causing the curing agent to cure in a state where the first projection and recess pattern is in contact with the curing agent.
1. A processing method comprising:
measuring a recess portion shape of a first projection and recess pattern formed on a surface of a template;
calculating a distribution of the recess portion shape based on a measurement result of the recess portion shape;
calculating a distribution of an application amount of a curing agent to a first processing target layer based on the distribution of the recess portion shape;
applying the curing agent to the first processing target layer based on the distribution of the application amount of the curing agent to have a distribution of the application amount of the curing agent in a direction of the plane of the first processing target layer;
forming a second projection and recess pattern by transferring the first projection and recess pattern onto the curing agent by causing the curing agent to cure in a state where the first projection and recess pattern is in contact with the curing agent;
separating the first projection and recess pattern from the cured curing agent;
forming a third projection and recess pattern by processing the first processing target layer with the second projection and recess pattern as a mask; and
calculating a distribution of an application amount of a curing agent to a second processing target layer based on the distribution of a recess portion shape of the third projection and recess pattern.
2. The processing method according to claim 1 , wherein the recess portion shape includes at least one of a width dimension of a recess portion of the first projection and recess pattern, a sidewall angle of a recess portion of the first projection and recess pattern, and a depth of a recess portion of the first projection and recess pattern.
3. The processing method according to claim 1 , wherein the curing agent is a photo-curing agent.