Backlight module
View Patent ↗A backlight module includes a heat-dissipating element, at least one light-emitting element disposed on a first side of the heat-dissipating element, a back plate, and a heat-insulation element. The back plate has at least one opening and is disposed on the first side of the heat-dissipating element, and the back plate is not overlapped with the light-emitting element. The heat-insulation element is disposed between the back plate and the heat-dissipating element for reducing heat conduction between the back plate and the heat-dissipating element so as to prevent the heat generated by the light-emitting element from being conducted to the back plate.
1. A backlight module, comprising:
a heat-dissipating element;
at least one light-emitting element disposed on a first side of the heat-dissipating element;
a back plate having at least one opening and disposed on the first side of the heat-dissipating element, wherein the light-emitting element is disposed within the opening, the back plate is not overlapped with the light-emitting element, and the back plate surrounds the light-emitting element and the heat-dissipating element; and
a heat-insulation element disposed between the back plate and the heat-dissipating element for reducing heat conduction between the back plate and the heat-dissipating element so as to prevent the heat generated by the light-emitting element from being conducted to the back plate.
2. The backlight module as claimed in claim 1 , further comprising a heat-conductive pad or a thermal grease disposed between the light-emitting element and the heat-dissipating element.
3. The backlight module as claimed in claim 1 , wherein the light-emitting element comprises a plurality of light-emitting diodes.
4. The backlight module as claimed in claim 1 , further comprising:
at least one screw fastened between the back plate and the heat-dissipating element.
5. A backlight module, comprising:
a back plate having a first side and a second side opposite the first side;
a heat-dissipating element disposed on the first side of the back plate;
a heat-insulation element disposed between the back plate and the heat-dissipating element for reducing heat conduction between the heat-dissipating element and the back plate; and
at least one light-emitting diode light bar disposed on the second side of the back plate;
wherein the back plate has at least one opening, the shape of the opening corresponds to the shape of the light-emitting diode light bar, and the light-emitting diode light bar is overlapped within the opening.
6. The backlight module as claimed in claim 5 , further comprising a heat-conductive pad or a thermal grease disposed between the light-emitting diode light bar and the heat-dissipating element.
7. The backlight module as claimed in claim 5 , further comprising:
at least one screw fastened between the back plate and the heat-dissipating element.
8. A backlight module, comprising:
at least one light-emitting element;
a heat-dissipating element connected to one side of the light-emitting element;
a retaining frame for accommodating at least one optical film, wherein the retaining flame has at least one opening, the opening corresponds to the light-emitting element, the light-emitting element is overlapped within the opening, and the retaining frame surrounds the light-emitting element; and
a heat-insulation element disposed between the retaining frame and the heat-dissipating element for reducing heat conduction between the heat-dissipating element and the retaining frame and preventing the heat generated by the light-emitting element from being conducted to the retaining frame.
9. The backlight module as claimed in claim 8 , further comprising a heat-conductive pad or a thermal grease disposed between the light-emitting element and the heat-dissipating element.
10. The backlight module as claimed in claim 8 , further comprising:
at least one screw fastened between the retaining frame and the heat-dissipating element.