Molded power-supply module with bridge inductor over other components
View Patent ↗An embodiment of a power-supply module includes a molded package, power-supply components disposed within the package, and an inductor disposed within the package and over the power-supply components. For example, for a given output-power rating, such a power-supply module may be smaller, more efficient, and more reliable than, and may run cooler than, a power-supply module having the inductor mounted outside of the package or side-by-side with other components. And for a given size, such a module may have a higher output-power rating than a module having the inductor mounted outside of the package or side-by-side with other components.
1. A power supply module, comprising:
a platform having a side;
a package disposed over the platform;
power supply components disposed within the package, disposed over the side of the platform, and attached to the platform; and
an inductor structure having an inductor body disposed within the package, disposed over the side of the platform, and disposed over the power supply components, the inductor structure also having an inductor disposed within the inductor body and having inductor leads attached to the inductor body and attached to the platform, wherein:
the platform includes a lead frame and a printed circuit board mounted to the lead frame;
one of the power supply components is mounted to the lead frame; and
another of the power supply components is mounted to the printed circuit board.
2. The power supply module of claim 1 wherein the package includes an epoxy resin.
3. The power supply module of claim 1 wherein one of the power supply components comprises a controller.
4. The power supply module of claim 1 wherein one of the power supply components comprises a transistor.
5. The power supply module of claim 1 wherein one of the power supply components comprises a resistor.
6. The power supply module of claim 1 wherein one of the power supply components comprises a capacitor.
7. The power supply module of claim 1 wherein the leads support the inductor body over the power supply components.
8. The power supply module of claim 1 , further comprising another inductor body disposed over the power supply components.
9. The power supply module of claim 1 wherein:
the inductor body is mounted to the lead frame.
10. The power supply module of claim 1 wherein:
the inductor body is mounted to the printed circuit board.
11. A system, comprising:
a power supply module, comprising:
a package;
a platform having a side and disposed beneath the package;
power supply components disposed within the package, disposed over the side of the platform, and attached to the platform;
an inductor body disposed within the package, over the power supply components, and over the side of the platform;
inductor leads attached to the inductor body and attached to the platform; and
a supply output node, wherein:
the platform includes a lead frame and a printed circuit board mounted to the lead frame;
one of the power supply components is mounted to the lead frame; and
another of the power supply components is mounted to the printed circuit board; and
an apparatus coupled to the supply output node.
12. The system of claim 11 wherein the apparatus comprises an integrated circuit.
13. The system of claim 12 wherein the integrated circuit comprises a processor.
14. The system of claim 12 wherein the integrated circuit comprises a memory.
15. A method, comprising:
attaching power supply components to a platform over a side of the platform;
attaching an inductor body to the platform via inductor leads, the inductor body disposed over the power supply components and over the side of the platform; and
forming a package over the inductor body, the inductor leads, the power supply components, and the platform, wherein the platform includes a lead frame, the method further comprising:
mounting a printed circuit board to the lead frame;
mounting one of the power supply components to the lead frame; and
mounting another of the power supply components to the printed circuit board.
16. The method of claim 15 wherein:
attaching the inductor body includes mounting the inductor body to the platform over the components.
17. The method of claim 15 wherein forming the package comprises encapsulating the inductor body and the power supply components in a packaging material.
18. The method of claim 15 wherein:
attaching the inductor body includes attaching multiple inductor bodies to the platform over the power supply components; and
forming the package comprises forming the package over the inductor bodies and the components.
19. A power supply module, comprising:
a platform having a side;
a package disposed over the platform;
power supply components disposed within the package and over the side of the platform; and
an inductor structure having an inductor body and inductor leads, the inductor body disposed within the package, over the power supply components, and over the side of the platform such that none of the power supply components support the inductor body, wherein:
the platform includes a lead frame and a printed circuit board mounted to the lead frame;
one of the power supply components is mounted to the lead frame; and
another of the power supply components is mounted to the printed circuit board.