Solid-state image sensing device
View Patent ↗A solid-state image sensing device comprises: a light receiving unit for receiving light; a microlens formed above the light receiving unit; a fluorine-containing resin material layer formed on the microlens; and a transparent substrate provided over the fluorine-containing resin material layer. A resin layer adheres the fluorine-containing resin material layer and the transparent substrate.
1. A solid-state image sensing device comprising:
a plurality of light receiving units provided in a predetermined region on a semiconductor substrate and receiving light; and
a transparent substrate provided over the semiconductor substrate to cover the plurality of light receiving units,
wherein a resin layer adheres the semiconductor substrate and the transparent substrate,
the thickness of the resin layer is defined by the height of a spacer disposed around the predetermined region, and
when the height of the spacer is set at 1 0 [μm] and the thickness from the top surface of the semiconductor substrate to the bottom end of the spacer is set at 1 1 [μm], the relation: 1 0 >10 [μm]−1 1 is satisfied.
2. The device of claim 1 , wherein the spacer is made of resin.
3. The device of claim 1 , wherein the spacer is made of an inorganic material.
4. The device of claim 1 , wherein the spacer is formed on the semiconductor substrate or on a flattening film lying on the semiconductor substrate.
5. The device of claim 1 ,
wherein the predetermined region is quadrangular, and
the spacer is provided along at least two facing sides of the predetermined region.
6. A solid-state image sensing device comprising:
a plurality of light receiving units provided in a predetermined region on a semiconductor substrate and receiving light;
a transparent substrate provided over the semiconductor substrate to cover the plurality of light receiving units, and
an amplifier unit arranged around the predetermined region on the semiconductor substrate and amplifying a signal outputted from the plurality of light receiving units,
wherein a resin layer adheres the semiconductor substrate and the transparent substrate,
the thickness of the resin layer is defined by the height of a spacer disposed around the predetermined region, and
the spacer is formed at least between the amplifier unit and the predetermined region, and the spacer is provided with an opening not to face the amplifier unit.
7. The device of claim 6 , wherein the spacer is made of resin.
8. The device of claim 6 , wherein the spacer is made of an inorganic material.
9. The device of claim 6 , wherein the spacer is formed on the semiconductor substrate or on a flattening film lying on the semiconductor substrate.
10. The device of claim 6 ,
wherein the predetermined region is quadrangular, and
the spacer is provided along at least two facing sides of the predetermined region.