Wavelength-converted semiconductor light emitting device
View Patent ↗A material such as a phosphor is optically coupled to a semiconductor structure including a light emitting region disposed between an n-type region and a p-type region, in order to efficiently extract light from the light emitting region into the phosphor. The phosphor may be phosphor grains in direct contact with a surface of the semiconductor structure, or a ceramic phosphor bonded to the semiconductor structure, or to a thin nucleation structure on which the semiconductor structure may be grown. The phosphor is preferably highly absorbent and highly efficient. When the semiconductor structure emits light into such a highly efficient, highly absorbent phosphor, the phosphor may efficiently extract light from the structure, reducing the optical losses present in prior art devices.
1. A structure comprising: a ceramic body; and
a nucleation layer that is thinner than one hundred microns; and
a bonded interface that connects the ceramic body to the nucleation layer, the bonded interface being disposed between the ceramic body and the nucleation layer; and: a nucleation structure that is grown on the nucleation layer; wherein the nucleation structure includes a light emitting region disposed between an n-type region and a p- type region, the light emitting region is configured to emit light of a first peak wavelength, and any separation between the ceramic body and the nucleation layer is less than one hundred microns.
2. The structure of claim 1 , wherein the ceramic body includes a wavelength conversion material that absorbs light of the first peak wavelength and emits light of a second peak wavelength.
3. The structure of claim 1 , wherein the nucleation layer is selected from the group of GaN, AlN, SiC, and Al 2 O 3 .
4. The structure of claim 1 , wherein any separation between the ceramic body and the nucleation layer is less than 10 microns.
5. The structure of claim 1 , further including a reflective surface that reflects light from the nucleation structure toward the ceramic body.
6. A structure comprising:
a package element;
a ceramic body; and
a semiconductor structure disposed between and connected to the ceramic body and the package element, the semiconductor structure including:
a nucleation layer that is connected to the ceramic body, and
a nucleation structure that is grown on the nucleation layer and includes a light emitting region disposed between an n-type region and a p-type region, the light emitting region being configured to emit light of a first peak wavelength;
wherein the package element is separated from the ceramic body by less than one hundred microns and the package element has a lateral extent exceeding a lateral extent of the semiconductor structure.
7. The structure of claim 6 , wherein the ceramic body includes a wavelength conversion material that absorbs light of the first peak wavelength and emits light of a second peak wavelength.
8. The structure of claim 6 , further including a reflective surface that reflects light from the semiconductor structure toward the ceramic body.
9. The structure of claim 6 , wherein a distance between the ceramic body and the nucleation layer is less than 100 microns.
10. The structure of claim 6 , wherein a distance between the ceramic body and the nucleation layer is less than 10 microns.
11. The structure of claim 6 , wherein the nucleation layer is selected from the group of GaN, AlN, SiC, and Al 2 O 3 .