IP Library Granted Patent US 8,246,893
Granted Patent B2
US 8,246,893 · App. 13/049,448 · Granted Aug 21, 2012

Method of molding a microneedle

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Quick Facts
Patent No.
US 8,246,893
App. No.
13/049,448
Granted
Aug 21, 2012
Kind
B2
Abstract

A method of molding a microneedle using a mold apparatus that includes the use of high frequency acoustic energy, such as ultrasonic energy.

Claims (24)

1. A method of molding a microneedle array comprising:

(i) providing a mold apparatus comprising:

a mold insert having the negative image of at least one microneedle;

a compression core; and

a mold housing configured to allow a reciprocal motion between the mold insert and the compression core,

wherein the mold apparatus has an open position and a closed position;

(ii) placing the mold apparatus in the closed position;

(iii) applying acoustic energy having a frequency greater than about 5,000 Hz to the mold apparatus;

(iv) injecting polymeric material into the closed mold apparatus;

(v) compressing the injected polymeric material between the mold insert and the compression core by a reciprocal motion between the compression core and the mold insert;

(vi) opening the mold; and

(vii) removing the molded microneedle from the mold.

2. A method as claimed in claim 1 wherein the acoustic energy is ultrasonic energy that is applied to the mold insert.

3. A method as claimed in claim 1 , wherein the polymeric material is polycarbonate.

4. A method as claimed in claim 1 wherein the compressive force applied to the mold cavity during the compressing step is greater than 5000 psi (34500 kPa).

5. A method as claimed in claim 1 wherein the mold insert has the negative image of a plurality of microneedles in the form of an array.

6. A method as claimed in claim 5 wherein the mold insert has the negative image of a plurality of arrays.

7. A method as claimed in claim 5 wherein the molded microneedle is formed as part of a microneedle array comprising a plurality of microneedles integrally formed with a substrate.

8. A method as claimed in claim 5 , wherein the microneedle array comprises a plurality of molded microneedles having a height greater than about 95 percent of the corresponding height of the microneedle topography in the mold insert.

9. A method as claimed in claim 7 wherein the acoustic energy is applied in a direction perpendicular to the plane of the microneedle array.

10. A method as claimed in claim 7 wherein the acoustic energy is applied in a direction parallel to the plane of the microneedle array.

11. A method as claimed in claim 1 wherein the acoustic energy is applied by an ultrasonic horn.

12. A method as claimed in claim 11 wherein the ultrasonic horn directly contacts the injected polymeric material.

13. A method as claimed in claim 11 wherein the ultrasonic horn is cross-shaped.

Assignments (4)
SECURITY INTEREST Recorded Dec 14, 2022
From: KINDEVA DRUG DELIVERY L.P.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 062122/0618 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL RECORDED AT R/F 053586/0715 Recorded Dec 12, 2022
From: MIDCAP FINANCIAL TRUST, AS ADMINISTRATIVE AGENT
To: KINDEVA DRUG DELIVERY L.P.
Reel/Frame 062115/0707 →
SECURITY INTEREST Recorded Aug 24, 2020
From: KINDEVA DRUG DELIVERY L.P.
To: MIDCAP FINANCIAL TRUST, AS ADMINISTRATIVE AGENT
Reel/Frame 053586/0715 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2020
From: 3M COMPANY; 3M INNOVATIVE PROPERTIES COMPANY
To: KINDEVA DRUG DELIVERY L.P.
Reel/Frame 052818/0234 →