Photovoltaic device with crystalline layer
View Patent ↗A method for manufacturing a multilayered structure may include forming a transparent conductive oxide layer including cadmium stannate adjacent to a substrate and annealing the structure in an annealing environment including a reducing agent at a temperature greater than 500 degrees C. to crystallize the cadmium stannate.
1. A method for manufacturing a structure comprising:
forming a transparent conductive oxide layer over a substrate, wherein the transparent conductive oxide layer comprises cadmium stannate;
forming a buffer layer comprising tin oxide over the transparent conductive oxide layer; and
annealing the structure in an annealing environment comprising a reducing agent at a temperature greater than 500 degrees C. to crystallize the cadmium stannate and tin oxide.
2. The method of claim 1 further comprising, subsequent to the annealing, forming a semiconductor window layer over the buffer layer and a semiconductor absorber layer over the semiconductor window layer, wherein the semiconductor window layer comprises cadmium sulfide and the semiconductor absorber layer comprises cadmium telluride.
3. The method of claim 2 , wherein the semiconductor window layer is adjacent to the buffer layer and the semiconductor absorber layer is adjacent to the semiconductor window layer.
4. The method of claim 1 , wherein the reducing agent comprises forming gas.
5. The method of claim 1 , wherein the reducing agent comprises hydrogen.
6. The method of claim 4 , wherein the hydrogen concentration of forming gas in the annealing environment is less than about 1500 ppm.
7. The method of claim 4 , wherein the hydrogen concentration of forming gas in the annealing environment is between about 800 ppm and 1200 ppm.
8. The method of claim 4 , wherein the hydrogen concentration of forming gas in the annealing environment is between about 500 ppm and 1000 ppm.
9. The method of claim 4 , wherein the hydrogen concentration of forming gas in the annealing environment is between about 1 ppm and 500 ppm.
10. The method of claim 9 , wherein the annealing temperature is between about 550 degrees C. and about 600 degrees C.
11. The method of claim 4 , wherein the hydrogen concentration of forming gas in the annealing environment is between about 100 ppm and 200 ppm.
12. The method of claim 11 , wherein the annealing temperature is between about 575 degrees C. and about 625 degrees C.
13. The method of claim 7 , wherein the annealing temperature is between about 600 degrees C. and about 650 degrees C.
14. The method of claim 5 , wherein the reducing agent comprises natural gas.
15. The method of claim 1 , wherein the reducing agent comprises nitrogen.
16. The method of claim 1 , wherein the reducing agent comprises nitrogen and hydrogen.
17. The method of claim 1 , wherein the annealing environment further comprises oxygen.
18. The method of claim 1 , wherein the annealing temperature is between about 525 degrees C. and about 700 degrees C.
19. The method of claim 1 , further comprising monitoring and adjusting a concentration of oxygen in the annealing environment during the step of annealing.
20. The method of claim 1 , further comprising monitoring and adjusting a concentration of hydrogen in the annealing environment during the step of annealing.
21. The method of claim 1 , wherein the step of annealing has a duration of between about 1 minute and about 60 minutes.
22. The method of claim 1 , wherein the step of annealing has a duration of between about 20 minutes and about 40 minutes.
23. The method of claim 1 , wherein the step of annealing has a duration of between about 10 minutes and about 30 minutes.
24. The method of claim 1 , wherein the step of annealing has a duration of between about 1 minute and about 15 minutes.
25. The method of claim 1 , wherein the transparent conductive oxide layer is adjacent to the substrate.
26. The method of claim 1 , wherein the buffer layer is adjacent to the transparent conductive oxide layer.
27. A method for manufacturing a structure, the method comprising:
forming a barrier layer adjacent to a substrate, wherein the substrate comprises soda-lime glass and the barrier layer comprises a material selected from the group consisting of a silicon oxide and a silicon nitride;
forming a transparent conductive oxide layer adjacent to the barrier layer, wherein the transparent conductive oxide layer comprises cadmium stannate;
forming a buffer layer adjacent to the transparent conductive oxide layer, wherein the buffer layer comprises tin oxide; and
annealing the structure in an annealing environment comprising forming gas at a temperature greater than 500 degrees C. to crystallize the cadmium stannate in the transparent conductive oxide layer and the tin oxide in the buffer layer.
28. The method of claim 27 , further comprising the steps of:
subsequent to the annealing:
forming a semiconductor window layer comprising cadmium sulfide adjacent to the buffer layer;
forming a semiconductor absorber layer comprising cadmium telluride adjacent to the semiconductor window layer; and
forming a back contact adjacent to the semiconductor absorber layer.
29. The method of claim 27 , wherein the hydrogen concentration of forming gas in the annealing environment is less than about 1500 ppm.
30. The method of claim 27 , wherein the annealing temperature is between about 525 degrees C. and about 700 degrees C.
31. The method of claim 27 , wherein the step of annealing has a duration of between about 1 minute and about 60 minutes.