IP Library Granted Patent US 8,808,963
Granted Patent B2
US 8,808,963 · App. 13/050,522 · Granted Aug 19, 2014

Photoresist composition and method of manufacturing array substrate using the same

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Quick Facts
Patent No.
US 8,808,963
App. No.
13/050,522
Granted
Aug 19, 2014
Kind
B2
Abstract

A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent.

Claims (20)

1. A photoresist composition, comprising:

a binder resin;

a photo acid generator;

an acryl resin represented by Chemical Formula 1; and

a solvent,

wherein R 1 , R 2 , R 3 , R 4 , and R 5 each represent a hydrogen atom or an alkyl group having 1-4 carbon atoms, and a, b, d, and e each represent a value in a range of about 0.01 to about 0.99, and the sum of a, b, d, and e is 1.

2. The photoresist composition of claim 1 , wherein a is about 0.5 to about 0.6, b is about 0.25 to about 0.35, d is about 0.05 to about 0.15, and e is about 0.01 to about 0.1.

3. The photoresist composition of claim 2 , wherein the acryl resin is represented by Chemical Formula 2,

4. The photoresist composition of claim 1 , wherein a content of the acryl resin is about 1% to about 20% by weight of the photoresist composition.

5. The photoresist composition of claim 4 , wherein a content of the binder resin is about 1% to about 50% by weight of the photoresist composition.

6. The photoresist composition of claim 4 , wherein a content of the photo acid generator is about 1% to about 20% by weight of the photoresist composition.

7. The photoresist composition of claim 1 , further comprising a hydroxyl phenol derivative being represented by Chemical Formula 3,

wherein R 6 , R 7 , and R 8 each represent an alkyl group having 1-3 carbon atoms.

8. The photoresist composition of claim 7 , wherein R 6 , R 7 , and R 8 each represent a methyl group.

9. The photoresist composition of claim 7 , wherein a content of the hydroxyl phenol derivative is about 1% to about 10% by weight of the photoresist composition.

10. The photoresist composition of claim 1 , wherein a weight average molecular weight of the acryl resin is about 5,000 to about 30,000.

11. The photoresist composition of claim 1 , further comprising an additive, the additive comprising at least one of a dye, an adhesion promoter, and an acid diffusion inhibitor.

12. The photoresist composition of claim 1 , wherein a is about 0.55, b is about 0.3, d is about 0.1, and e is about 0.05.

13. The photoresist composition of claim 1 , wherein the binder resin is cross-linked.

14. The photoresist composition of claim 1 , wherein the binder resin comprises a phenol compound reacted with an aldehyde compound in the presence of an acidic catalyst.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2022
From: MERCK PATENT GMBH
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 060382/0929 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2016
From: MERCK ELECTRONIC MATERIALS LTD.
To: MERCK PATENT GMBH
Reel/Frame 040243/0603 →
CHANGE OF NAME Recorded Nov 7, 2016
From: AZ ELECTRONIC MATERIALS KOREA LTD.
To: MERCK ELECTRONIC MATERIALS LTD.
Reel/Frame 040859/0975 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2013
From: AZ ELECTRONIC MATERIALS (JAPAN) K.K
To: AZ ELECTRONIC MATERIALS (KOREA) LTD.
Reel/Frame 029649/0736 →
CHANGE OF NAME Recorded Aug 28, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028863/0858 →