Electronic device, electronic module, and methods for manufacturing the same

1. An electronic device, comprising:

an outline configuration including:

a first surface;

a second surface facing opposite from the first surface; and

a mounting surface coupled to the first and second surfaces;

a first substrate including a first electrode;

a second substrate including a second electrode;

a resin disposed between the first and second substrates; and

an electric element having an outline configuration of a polyhedron and sealed within a package situated within the resin, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate, wherein:

the first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin;

the second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin;

the mounting surface includes:

an exposed surface of the resin between the first and second substrates; and

side surfaces of the first and second substrates adjacent to the exposed surface;

the first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element; and

the second electrode is disposed at an end of the second surface adjacent to the mounting surface.

2. The electronic device according to claim 1 , wherein each of the first and second electrodes includes a portion constituting part of the mounting surface.

3. The electronic device according to claim 1 , wherein:

the first electrode is disposed from a periphery of the first surface with an interval; and

the second electrode is disposed from a periphery of the second surface with an interval.

4. The electronic device according to claim 1 , wherein:

the first electrode is disposed on the first surface adjacent to the mounting surface; and

the second electrode is disposed on the second surface adjacent to the mounting surface.

5. The electronic device according to claim 4 , wherein each of the first and second electrodes includes a side surface electrode portion reaching to the side surface of each of the respective first and second substrates.

6. The electronic device according to claim 1 , wherein:

the first and second electrodes are disposed only on the respective first and second surfaces while avoiding the side surface of the respective first and second substrates.

7. The electronic device according to claim 1 , wherein:

the first and second surfaces are in parallel with each other; and

the first and second electrodes are positioned plane-symmetrically to each other using, as a reference plane, a plane located in parallel to and halfway between the first and second surfaces.

8. The electronic device according to claim 1 , wherein the first and second electrodes have an identical surface configuration.

9. The electronic device according to claim 1 , wherein the electric element is an inertial sensor element.

10. An electronic module, comprising:

the electronic device according to claim 1 ; and

a circuit board including a first interconnection and a second interconnection, wherein:

the electronic device is mounted above the circuit board with the mounting surface facing the circuit board; and

the first and second electrodes are connected to the respective first and second interconnections by a brazing material.