Semiconductor memory device and method of manufacturing the same
According to one embodiment, a semiconductor memory device with memory cells each composed of a vertical transistor, comprises a silicon layer formed into a columnar shape on a silicon substrate, a gate insulating film part in which a tunnel insulating film, a charge storage layer, and a block insulating film are formed to surround the sidewall surface of the silicon layer, and a stacked structure part formed to surround the sidewall surface of the gate insulating film part and in which a plurality of interlayer insulating films and a plurality of control gate electrode layers are stacked alternately. The silicon layer, gate insulating film part, and control gate electrode layer constitute the vertical transistor. The charge storage layer has a region lower in trap level than a region facing the control gate electrode layer between the vertical transistors.
1. A semiconductor memory device comprising:
a silicon layer of a columnar shape on a silicon substrate;
a plurality of vertical-transistor-formed layers and a plurality of interlayer insulators alternately laminated on the silicon substrate so as to surround the silicon layer;
each of the vertical-transistor-formed layers including, to surround the sidewall surface of the silicon layer in this order: a) a tunnel insulating film, b) a charge storage layer, c) a block insulating film, and d) a gate layer interposed between adjacent ones of the plurality of interlayer insulators; and
a plurality of separated insulating films formed between a first insulating film and a second insulating film, the first insulating film and the second insulating film being respectively extended from the tunnel insulating film and the blocking insulating film of an adjacent one of the vertical-transistor layers, to separate the plurality of charge storage layers from each other, the plurality of separated insulating films positioned in line with the plurality of charge storage layers,
wherein the charge storage layer and the separated insulating films include silicon nitride, each of the plurality of separated insulating films has a region lower in nitrogen concentration than the charge storage layer, and
the plurality of separated insulating films have regions lower in trap level than the charge storage layer.
2. The semiconductor memory device according to claim 1 , wherein
the tunnel insulating film and block insulating film include silicon dioxide.
3. The semiconductor memory device according to claim 1 , wherein the silicon layer includes a plurality of silicon layers arranged two-dimensionally in a first direction and in a second direction crossing the first direction, and an element isolating trench that isolates adjacent ones of the silicon layers in the first direction is formed between the adjacent ones of the silicon layers.
4. The semiconductor memory device according to claim 1 , wherein the plurality of vertical transistors are vertically adjacent to one another, and share a source and a drain, forming a NAND cell unit.
5. The semiconductor memory device according to claim 1 , wherein the plurality of insulating films and the plurality of charge storage layers are formed on a same level.
6. The semiconductor memory device according to claim 1 , wherein the regions of the plurality of separated insulating films lower in trap level than the charge storage layer face the plurality of interlayer insulators.