Method for producing a semiconductor component, and semiconductor component

1. A method for the manufacture of a semiconductor component, comprising:

providing a substrate made from a semiconductor material with a buried insulation layer and a connection pad made from an electrically conductive material arranged in the insulation layer;

creating an opening extending from a top side of the substrate up to the insulation layer above the connection pad;

depositing a dielectric layer;

removing the dielectric layer and the insulation layer within the opening to an extent that a top side of the connection pad is exposed;

depositing a metallization that contacts the connection pad; and

manufacturing a via contact extending from a back side of the substrate opposite the opening up to the connection pad.

2. The method according to claim 1 , wherein the opening is formed with a vertical side wall by an anisotropic etching process.

3. The method according to claim 1 , wherein the metallization is removed outside of the opening, and wherein a top metal is deposited such that the top metal contacts the top edges of the metallization.

4. The method according to claim 1 , wherein the metallization is initially manufactured over the entire surface area and then etched back at an etching rate that is higher on the top side than on the base and on the side walls of the openings, so that a portion of the metallization remains on the base of the opening.

5. The method according to claim 1 , wherein the top side of the substrate is provided with an intermetal dielectric and metal planes of a wiring before the etching of the opening,

wherein the top side of the intermetal dielectric is covered with a liner, and

wherein the material of the liner is selected so that the liner functions as an etching stop layer for the partial removal of the dielectric layer.

6. The method according to claim 1 , wherein the substrate is manufactured such that a first semiconductor body is provided on a top side with an insulation layer,

wherein a second semiconductor body is mounted on the insulation layer, and

wherein, before the connection of the semiconductor body, a connection pad is deposited on the insulation layer or on the top side of the second semiconductor body to be connected to the insulation layer.

7. The method according to claim 1 , wherein a passivation is manufactured on the metallization.

8. The method according to claim 7 , wherein the passivation is manufactured from at least two layers of different materials.

9. The method according to claim 8 , wherein a tempering step is carried out only before the last layer of the passivation has been deposited.

10. The method according to claim 7 , wherein the passivation is manufactured such that an oxide layer is initially deposited and a nitride layer is deposited on the oxide layer.

11. The method according to claim 7 , wherein a tempering step is carried out only before the passivation is deposited.