Method for the production of security elements having registered layers of designs
View Patent ↗The present invention relates to a method for producing a security element ( 1 ), to a security element ( 1 ) obtainable by the method according to the invention, to transfer materials having the security elements according to the invention, and to objects of value secured with the security elements according to the invention. The security element ( 1 ) according to the invention has two functional layers ( 12, 22 ) which are bonded together by means of a resist layer ( 30 ). The resist layer ( 30 ) has a pattern which is employed to generate a congruent pattern in the first functional layer ( 12 ). Then the pattern of the resist layer ( 30 ), and thus also of the first functional layer ( 12 ), is exactly reproduced in the second functional layer ( 22 ). This is achieved by bonding the second functional layer ( 22 ) in the form of the pattern of the resist layer ( 30 ). The non-bonded areas of the second functional layer ( 22 ) are removed, thereby forming negative writing.
1. A method for producing a security element with negative writing for a security paper or an object of value such as a value document, comprising the steps:
a) producing a first security-element partial element by
supplying a first transparent or translucent carrier substrate,
applying a first functional layer to the first carrier substrate or to a previously applied intermediate layer,
applying a resist layer to the first functional layer
in the form of a predetermined pattern with resist areas and gaps between the resist areas,
removing the areas of the first functional layer not protected by resist areas in order to form first functional areas and first gaps therebetween,
b) producing a second security-element partial element by
supplying a second carrier substrate,
applying a second functional layer to the second carrier substrate or to a previously applied intermediate layer,
c) assembling the first and the second security-element partial elements to a composite such that the resist layer and the second functional layer face each other, and bonding the first and the second security-element partial elements, and
d) detaching the second carrier substrate from the bonded composite, whereby the second functional layer adheres to the resist areas so as to form second functional areas, while the remaining areas of the second functional layer are detached together with the second carrier substrate, thereby forming in the second functional layer second gaps which, together with the gaps in the resist layer and the first gaps in the first functional layer, form the negative writing.
2. The method according to claim 1 , wherein the first security-element partial element is produced by
supplying the first carrier substrate,
applying a first embossing lacquer layer as an intermediate layer to the first carrier substrate,
applying a first metallization as the first functional layer to the first embossing lacquer layer,
embossing the first embossing lacquer layer before or after applying the first metallization,
applying the resist layer to the first metallization, whereby the resist layer has resist areas and gaps, or resist areas and gaps are formed therein, and
forming first gaps in the first metallization by removing the areas of the first metallization not protected by resist areas.
3. The method according to claim 1 , wherein the second security-element partial element is produced by
supplying the second carrier substrate,
applying a second embossing lacquer layer as an intermediate layer to the second carrier substrate,
applying a second metallization as the second functional layer to the second embossing lacquer layer,
embossing the second embossing lacquer layer before or after applying the second metallization.
4. The method according to claim 1 , wherein as the first functional layer and/or as the second functional layer there is applied an ink layer, said ink layer being multicolored or not multicolored.
5. The method according to claim 1 , wherein the first functional layer and/or the second functional layer is (are) applied only in partial areas, and the process of bonding the first and the second security-element partial elements and detaching the second carrier substrate is carried out successively with at least two second security-element partial elements, thereby forming different second functional areas in the second functional layer of the security element.
6. The method according to claim 1 , wherein the resist areas are formed as lines of a defined width y.
7. The method according to claim 1 , wherein the resist layer is applied as a pattern in which the resist areas and the gaps form a subpattern as well.
8. The method according to claim 7 , wherein the resist areas are formed as lines of a defined width y, and the subpattern is generated by varying the width y of the lines.