IP Library Granted Patent US 8,565,465
Granted Patent B2
US 8,565,465 · App. 13/056,513 · Granted Oct 22, 2013

Microphone unit and mobile phone provided with the same

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Quick Facts
Patent No.
US 8,565,465
App. No.
13/056,513
Granted
Oct 22, 2013
Kind
B2
Abstract

Provided is a microphone unit having flat frequency characteristics. A microphone unit includes a casing, a first substrate, a second substrate, a vibrating unit, a diaphragm, an ASIC, and a dummy component. The dummy component is attached to the substrate to be located below an opening.

Claims (20)

1. A microphone unit, comprising:

a casing having an internal space and a first opening, a portion of said casing including a substrate portion facing said internal space;

a vibrating portion mounted on said substrate portion facing said internal space to convert acoustic vibration into an electric signal; and

an acoustic correction member mounted on said substrate portion facing said internal space to correct characteristics of acoustic transmission from said first opening to said vibrating portion.

2. The microphone unit according to claim 1 , wherein

said internal space includes a first partial space and a second partial space,

said vibrating portion is arranged between the first partial space and the second partial space,

a second opening connected to the second partial space is further formed in said casing portion,

said first opening is connected to said first partial space, and

said acoustic correction member is placed in at least one of said first partial space and said second partial space.

3. The microphone unit according to claim 2 , wherein said acoustic correction member is formed such that an air volume of the first partial space is equal to an air volume of the second partial space.

4. The microphone unit according to claim 2 , wherein said acoustic correction member has a shape formed such that an acoustic impedance from said first opening to said vibrating portion is equal to an acoustic impedance from said second opening to said vibrating portion.

5. The microphone unit according to claim 1 , wherein said vibrating portion is arranged to be offset from a central axis of said first opening.

6. The microphone unit according to claim 1 , wherein said acoustic correction member is arranged below said first opening.

7. The microphone unit according to claim 1 , wherein said acoustic correction member is an insulator.

8. The microphone unit according to claim 1 , wherein said acoustic correction member is formed of a conductive material and fixed to a ground potential.

9. The microphone unit according to claim 1 , wherein said acoustic correction member is fitted in said casing.

10. The microphone unit according to claim 1 , further comprising a substrate, wherein said acoustic correction member is solder-bonded to said substrate.

11. A mobile phone provided with the microphone unit according to claim 1 .

12. The microphone unit according to claim 1 , wherein the vibrating portion is a diaphragm.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2016
From: FUNAI ELECTRIC CO., LTD.
To: ONPA TECHNOLOGIES INC.
Reel/Frame 039857/0169 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2015
From: FUNAI ELECTRIC ADVANCED APPLIED TECHNOLOGY RESEARCH INSTITUTE INC.
To: FUNAI ELECTRIC CO., LTD.
Reel/Frame 035295/0038 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2011
From: INODA, TAKESHI; HORIBE, RYUSUKE; TANAKA, FUMINORI; TAKANO, RIKUO; SUGIYAMA, KIYOSHI; FUKUOKA, TOSHIMI; ONO, MASATOSHI
To: FUNAI ELECTRIC CO., LTD.; FUNAI ELECTRIC ADVANCED APPLIED TECHNOLOGY RESEARCH INSTITUTE INC.
Reel/Frame 025955/0056 →