Heat exchange structure and cooling device comprising such a structure
A heat exchange structure is provided, including a primary face provided with non-through holes formed in said face, the inner surface of the holes and the surface of said primary face outside the holes being covered with nanoparticles, the inside of the holes having a non-wettability property relative to a given liquid and the surface of the face between the holes having a wettability property relative to the liquid.
1. A heat exchange structure, comprising:
a substrate including a plurality of non-through holes disposed therein, the plurality of non-through holes being arranged in a microstructure pattern across a primary face of the substrate, each of the plurality of non-through holes having a continuous sidewall, each continuous sidewall preventing fluid communication with others of the plurality of non-through holes in the microstructure pattern below the primary face of the substrate;
a first nanostructure layer disposed on each bottom of the plurality of non-through holes and on each continuous sidewall of the plurality of non-through holes, the first nanostructure layer having a nanotextured topography of greater surface area than that of said each bottom and said each continuous sidewall disposed thereunder, and the first nanostructure layer including a plurality of vapor nucleation sites collectively disposed between individual nanostructures along the nanotextured topography; and
a second nanostructure layer disposed on the primary face of the substrate,
wherein the first nanostructure layer disposed on said each bottom and said each sidewall of the plurality of non-through holes is non-wetting relative to a given liquid, and
wherein the second nanostructure layer disposed on the primary face of the substrate is wetting relative to the liquid.
2. The heat exchange structure according to claim 1 , wherein the holes have a dimension between 1 μm and 10 μm, a depth between 1 μm and 10 μm and are distributed on the primary face such that there is between 1 hole/mm 2 and 100 holes/mm 2 .
3. The heat exchange structure according to claim 1 , wherein the ratio between an area of a non-wetting surface of the first nanostructure layer and a total surface area is less than about 15%.
4. The heat exchange structure according to claim 1 , wherein an inner surface of the holes has a hysteresis less than 15°.
5. The heat exchange structure according to claim 1 , wherein the first nanostructure layer and the second nanostructure layer are obtained by depositing nanoparticles whereof the size is between 1 nm and 100 nm.
6. A cooling system, comprising:
an evaporator;
a condenser; and
a fluid capable of going from a liquid phase to a vapor phase at the evaporator and a vapor phase to a liquid phase at the condenser,
the evaporator being a heat exchange structure comprising a substrate including a plurality of non-through holes disposed therein, the plurality of non-through holes being arranged in a microstructure pattern across a primary face of the substrate, each of the plurality of non-through holes having a continuous sidewall, each continuous sidewall preventing fluid communication with others of the plurality of non-through holes in the microstructure pattern below the primary face of the substrate;
a first nanostructure layer disposed on each bottom of the plurality of non-through holes and on each continuous sidewall of the plurality of non-through holes, the first nanostructure layer having a nanotextured topography of greater surface area than that of said each bottom and said each continuous sidewall disclosed thereunder, and the first nanostructure layer including a plurality of vapor nucleation sites collectively disposed between individual nanostructures along the nanotextured topography; and
a second nanostructure layer disposed on the primary face of the substrate,
wherein the first nanostructure layer disposed on said each bottom and said each sidewall of the plurality of non-through holes is non-wetting relative to a given liquid, and
wherein the second nanostructure layer disposed on the primary face of the substrate is wetting relative to the liquid.
7. The cooling system according to claim 6 , forming a heat pipe, an array of capillaries configured to pass the fluid in liquid phase from the condenser to the evaporator.
8. An electronic or microelectronic device, comprising:
a cooling system, comprising:
an evaporator;
a condenser; and
a fluid capable of going from a liquid phase to a vapor phase at the evaporator and a vapor phase to a liquid phase at the condenser,
the evaporator being a heat exchange structure comprising a substrate including a plurality of non-through holes disposed therein, the plurality of non-through holes being arranged in a microstructure pattern across a primary face of the substrate, each of the plurality of non-through holes having a continuous sidewall, each continuous sidewall preventing fluid communication with others of the plurality of non-through holes in the microstructure pattern below the primary face of the substrate;
a first nanostructure layer disposed on each bottom of the plurality of non-through holes and on each continuous sidewall of the plurality of non-through holes, the first nanostructure layer having a nanotextured topography of greater surface area than that of said each bottom and said each continuous sidewall disclosed thereunder, and the first nanostructure layer including a plurality of vapor nucleation sites collectively disposed between individual nanostructures along the nanotextured topography; and
a second nanostructure layer disposed on the primary face of the substrate,
wherein the first nanostructure layer disposed on said each bottom and said each sidewall of the plurality of non-through holes is non-wetting relative to a given liquid, and
wherein the second nanostructure layer disposed on the primary face of the substrate is wetting relative to the liquid,
the cooling system being attached on a substrate of the device or integrated therein.
9. An onboard or portable device, comprising:
a cooling system, comprising:
an evaporator;
a condenser; and
a fluid capable of going from a liquid phase to a vapor phase at the evaporator and a vapor phase to a liquid phase at the condenser,
the evaporator being a heat exchange structure comprising a substrate including a plurality of non-through holes disposed therein, the plurality of non-through holes being arranged in a microstructure pattern across a primary face of the substrate, each of the plurality of non-through holes having a continuous sidewall, each continuous sidewall preventing fluid communication with others of the plurality of non-through holes in the microstructure pattern below the primary face of the substrate;
a first nanostructure layer disposed on each bottom of the plurality of non-through holes and on each continuous sidewall of the plurality of non-through holes, the first nanostructure layer having a nanotextured topography of greater surface are than that of said each bottom and said each continuous sidewall disclosed thereunder, and the first nanostructure layer including a plurality of vapor nucleation sites collectively disposed between individual nanostructures along the nanotextured topography; and
a second nanostructure layer disposed on the primary face of the substrate,
wherein the first nanostructure layer disposed on said each bottom and said each sidewall of the plurality of non-through holes is non-wetting relative to a given liquid, and
wherein the second nanostructure layer disposed on the primary face of the substrate is wetting relative to the liquid.