Device for electromagnetic shielding and dissipation of heat released by an electronic component, and corresponding electronic circuit
View Patent ↗A device is provided for electromagnetic shielding an electronic component and for dissipating heat generated by the component. The component includes a package designed to be fastened to a first face of a printed circuit, called a rear face, by a heat sink, the heat sink passing through the rear face of the printed circuit and emerging on a second face of the printed circuit, called a front face. The device includes a metal structure mounted on the front face of the printed circuit and defining an electromagnetic shielding enclosure. The metal structure having a first heat discharge opening lying approximately opposite the heat sink. The device further includes at least one thermal connector, a first end of which is fastened to the metal structure and a second end of which is fastened to the heat sink and/or to the front face of the printed circuit near the heat sink.
1. A device for electromagnetic shielding and for dissipating heat released by an electronic component, said component comprising a package designed to be fixedly joined to a first face of a printed circuit, called a rear face, by a heat sink, said heat sink going through the rear face of the printed circuit and emerging on a second face of the printed circuit, called a front face, wherein said device comprises:
a metal or metalized structure mounted on the front face of the printed circuit and defining an electromagnetic shielding enclosure, said metal or metalized structure comprising a first aperture for discharging heat and extending appreciably so as to be facing said heat sink; and
at least one thermal connector, a first end of which is fixedly joined to said metal or metalized structure and a second end of which is fixedly joined to at least one of said heat sink or the front face of the printed circuit in a vicinity of said heat sink.
2. The device according to claim 1 , wherein the device comprises an element forming a channel for discharging heat from said heat sink to said first aperture.
3. The device according to claim 2 , wherein said element forming a discharge channel includes said connector or at least one of a plurality of the connectors.
4. The device according to claim 1 , wherein each connector is made out of a metallic material.
5. The device according to claim 1 , wherein said structure comprises at least one second aperture situated in a vicinity of said first aperture.
6. The device according to claim 1 , wherein said component comprises a power amplifier.
7. An electronic circuit comprising:
a printed circuit comprising an electronic component, which releases heat, said component comprising a package fixedly joined to a first face of the printed circuit, called a rear face, by a heat sink, said heat sink going through the rear face of the printed circuit and emerging on a second face of the printed circuit, called a front face; and
a device comprising:
a metal or metalized structure mounted on the front face of the printed circuit and defining an electromagnetic shielding enclosure, said metal or metalized structure comprising a first aperture for discharging heat and extending appreciably so as to be facing said heat sink; and
at least one thermal connector, a first end of which is fixedly joined to said metal or metalized structure and a second end of which is fixedly joined to at least one of said heat sink or the front face of the printed circuit in a vicinity of said heat sink.
8. The electronic circuit according to claim 7 , wherein the device comprises an element forming a channel for discharging heat from said heat sink to said first aperture.
9. The electronic circuit according to claim 8 , wherein said element forming a discharge channel includes said connector or at least one of a plurality of the connectors.
10. The electronic circuit according to claim 7 , wherein each connector is made out of a metallic material.
11. The electronic circuit according to claim 7 , wherein said structure comprises at least one second aperture situated in a vicinity of said first aperture.
12. The electronic circuit according to claim 7 , wherein said component comprises a power amplifier.