E-document comprising an electromagnetic interference element

1. A laminated structure for E-document, the structure being mounted between pages of the E-document and a cover of the E-document, the structure comprising a first support layer defining at least two flat flaps connected by at least one fold line:

the first flap supporting an antenna and a microcircuit device enabling contactless data exchange,

the second flap supporting an electromagnetic interference element arranged in relation to the microcircuit device so as to be able to oppose at least one of contactless reading and contactless writing of the microcircuit device in at least one folded configuration of the structure, wherein the structure comprises at least one heat-actiyated or pressure-sensitive adhesive layer making it possible to receive the microcircuit device and/or the antenna and/or the electromagnetic interference element at least in part in its thickness, and at least one of :

at least one fibrous layer, and

a polymer layer,

the at least one fibrous layer or polymer layer comprising second and third support layers, supported by the first flap and second flap, respectively, wherein the second and third support layers have different thicknesses for each of the flaps, the antenna being located between the first and the second support layers, and the electromagnetic interference element being located between the first and the third support layers.

2. The structure according to claim 1 , the electromagnetic interference element comprising a magnetic material, a conductive material, or a resonator circuit.

3. The structure according to claim 1 , the first support layer comprising at least one cavity in which the microcircuit device is at least partially housed.

4. The structure according to claim 3 , the cavity being a through cavity.

5. The structure according to claim 3 , wherein:

the second support layer comprises a cavity in which the microcircuit device is at least partially housed; and

the cavity of the first support layer and the cavity of the second support layer are at least partially opposite each other, so as to form a housing in order to receive the microcircuit device.

6. The structure according to claim 1 , the first support layer being of the fibrous or polymer type.

7. The structure according to claim 1 , the second support layer comprising a cavity in which the microcircuit device is at least partially housed.

8. The structure according to claim 7 , the cavity being a through cavity.

9. The structure according to claim 1 , the third support layer comprising a cavity in which the electromagnetic interference element is housed.

10. The structure according to claim 1 , comprising two adhesive layers supported by the first flap and the second flap, respectively, the two layers of adhesive having different thicknesses.

11. The structure according to claim 10 , the second flap comprising two adhesive layers between which the electromagnetic interference element is arranged.

12. The structure according to claim 1 , the adhesive layer supported by the first flap comprising a cavity in which the microcircuit device is at least partially housed.

13. The structure according to claim 1 , the second support layer only partially extending over the first flap and the third support layer only partially extending over the second flap, so as to arrange a thickness reserve at the fold line.

14. The structure according to claim 1 , comprising at least one layer of a heat-activated or pressure-sensitive adhesive between at least one of the first support layer and the second support layer, and the first support layer and the third support layer.

15. The structure according to claim 1 , the second and third support layers being of the fibrous or polymer type.

16. The structure according to claim 1 , comprising a surface layer extending over the first and second flaps.

17. The structure according to claim 16 , comprising at least one layer of a heat-activated or pressure-sensitive adhesive located between the first support layer and the surface layer and making it possible to receive at least one of the integrated microcircuit device, the antenna and the electromagnetic interference element at least partially in the thickness of the adhesive layer.

18. The structure according to claim 16 , the surface layer being made in polymer.

19. The structure according to claim 1 , comprising two flaps and being configured to be secured between the cover and the flyleaf of an E-document in the form of a booklet.

20. The structure according to claim 1 , the electromagnetic interference element extending over only one portion of the scope of the structure.

21. The structure according to claim 1 , the electromagnetic interference element extending over the entire scope of the structure.

22. The structure according to claim 1 , the first and second flaps being coplanar.

23. An E-document comprising a structure according to claim 1 .

24. A laminated structure for E-document, the structure being mounted between pages of the E-document and a cover of the E-document, the structure comprising a first support layer defining at least two flat flaps connected by at least one fold line:

the first flap supporting an antenna and a microcircuit device enabling contactless data exchange,

the second flap supporting an electromagnetic interference element arranged in relation to the microcircuit device so as to be able to oppose at least one of contactless reading and contactless writing of the microcircuit device in at least one folded configuration of the structure, the first support layer defining a third flap connected to the first flap or the second flap by a fold line,

wherein the structure comprises at least one of the following:

a) at least one heat-activated or pressure-sensitive adhesive layer making it possible to receive at least one of the microcircuit device, the antenna and the electromagnetic interference element at least in part in a thickness of the adhesive layer, and

b) flaps having at least one of :

at least one layer of an adhesive,

at least one fibrous layer, and

a polymer layer,

the adhesive layer, the fibrous layer or the polymer layer extending on both flaps and having a different thickness for each of the flaps.

25. The structure according to claim 24 , comprising a surface layer extending over the first, second, and third flaps.

26. The structure according to claim 25 , comprising at least one layer of a heat-activated or pressure-sensitive adhesive located between the first support layer and the surface layer and making it possible to receive at least one of the integrated microcircuit device, the antenna and, the electromagnetic interference element at least partially in the thickness of the adhesive layer.

27. The structure according to claim 26 , the adhesive layer extending over the first, second, and third flaps.

28. The structure according to claim 27 , the adhesive layer extending continuously over the surface layer.

29. The structure according to claim 24 , the electromagnetic interference element comprising two interference element portions supported by the second and third flaps, respectively.

30. The structure according to claim 29 , the two interference element portions extending continuously beyond the fold line.

31. The structure according to claim 29 , the two interference element portions being distinct.