Arrangement comprising an electrical conductor track carrier and an optoelectronic component, and a method for producing such an arrangement

1. An arrangement ( 10 ) comprising an electrical conductor track carrier ( 20 ) and a component ( 30 ) applied on the conductor track carrier,

wherein the component is a fiber-optoelectronic component and has:

a housing ( 40 ),

at least one electro-optical or optoelectronic component ( 50 ),

at least one fiber-optic interface ( 60 ) connected to the electro-optical or optoelectronic component, and

at least one electrical interface ( 80 ) for connecting the component on the conductor track carrier,

wherein the electrical interface has at least one bent electrical soldering connection element ( 100 ), which extends laterally toward an outside of and is soldered laterally outside of an outer housing contour ( 140 ) on the conductor track carrier,

wherein the at least one bent electrical soldering connection element ( 100 ) is attached by one end ( 110 ) thereof to a base connection section ( 120 ) of a housing base ( 125 ) of the housing ( 40 ) and extends from there laterally toward the outside of the outer housing contour such that an other end ( 130 ) of the soldering connection element, in plan view, projects laterally and is soldered laterally outside of the outer housing contour ( 140 ) on the conductor track carrier, and

wherein the soldering connection element is bent away from the base connection section in such a way that the base connection section and with it the housing base ( 125 ) has a mechanical play constituting a distance (A) from the conductor track carrier.

2. The arrangement as claimed in claim 1 , wherein a reflection reducing characteristic impedance matching element ( 210 ) is present in at least one partial section of a gap ( 200 ) between the base connection section and the conductor track carrier.

3. The arrangement as claimed in claim 1 , wherein a gap ( 200 ) between the base connection section and the conductor track carrier is at least partially filled with a material ( 220 , 230 ) having a relative permittivity of greater than 1.

4. The arrangement as claimed in claim 1 , wherein a coating ( 220 ) is applied on the conductor track carrier in a region of a gap ( 200 ) between the base connection section and the conductor track carrier.

5. The arrangement as claimed in claim 4 , wherein the coating consists of a different material than a material of the conductor tracks ( 90 ) of the conductor track carrier.

6. The arrangement as claimed in claim 1 , wherein the housing base has a base bearing section ( 150 ), which bears directly on the conductor track carrier.

7. The arrangement as claimed in claim 1 , wherein the housing has at least one fixing section ( 160 ) screwed to the conductor track carrier.

8. The arrangement as claimed in claim 7 ,

wherein the fixing section has a fixing hole ( 170 ), through which a fixing screw ( 180 ) extends, and

wherein a diameter of the fixing hole is dimensioned to be greater than a diameter of the fixing screw, such that a play that reduces mechanical stresses is present between the fixing hole and the fixing screw.

9. The arrangement as claimed in claim 1 , wherein the electrical interface comprises a plurality of bent electrical soldering connection elements, which form one or a plurality of coplanar electrical lines.

10. The arrangement as claimed in claim 1 , wherein at least one bent electrical soldering connection element is slotted and forms at least two mutually adjacent electrical individual conductors ( 330 , 340 ).

11. The arrangement as claimed in claim 1 , wherein a group ( 300 , 350 ) of mutually adjacent bent electrical soldering connection elements is electrically connected up in the order ground, signal, ground, signal, ground.

12. The arrangement as claimed in claim 11 , wherein a central soldering connection element ( 310 ) of the group ( 350 ), connected to ground, is slotted and forms in each case two mutually adjacent individual ground conductors, such that an electrical connection configuration ground, signal, ground, ground, signal, ground arises at the interface with the conductor track carrier.

13. The arrangement as claimed in claim 1 , wherein

a thickness of the soldering connection elements connected up as ground conductors and a thickness of the soldering connection elements connected up as signal conductors are equal in magnitude and/or

a ratio between a width of an unslotted ground conductor and a width of a signal conductor is less than or equal to two and/or

a ratio between a width of an individual ground conductor of a slotted soldering connection element that is at ground potential and a width of a signal conductor is less than or equal to two.

14. A method for producing an arrangement ( 10 ) comprising an electrical conductor track carrier ( 20 ) and a component ( 30 ), wherein the component is a fiber-optoelectronic component having a housing ( 40 ), at least one electro-optical or optoelectronic component ( 50 ), at least one fiber-optic interface ( 60 ) connected to the component, and at least one electrical interface ( 80 ) for connecting the component on the conductor track carrier, the method comprising:

soldering the component on the conductor track carrier by attaching one end ( 110 ) of at least one bent electrical soldering connection element ( 100 ) to a base connection section ( 120 ) of a housing base ( 125 ) of the housing ( 40 ) and attaching an other end ( 130 ) of the soldering connection element laterally outside of the outer housing contour ( 140 ) on the conductor track carrier,

wherein a mechanical play constituting a distance (A) is created between the housing base ( 125 ) and the conductor track carrier.

15. The method as claimed in claim 14 , wherein a reflection reducing characteristic impedance matching ( 210 ) is performed in at least one partial section of a gap ( 200 ) between the base connection section and the conductor track carrier.