Surface mount electronic component and method for manufacturing the same

1. A surface mount electronic component, comprising:

an element including:

an anode;

a cathode formed on a part of a surface of the anode via a dielectric substance;

an anode terminal electrically connected to the anode;

a cathode terminal electrically connected to the cathode; and

an outer package body covering the element such that a part of the anode terminal and a part of the cathode terminal are exposed;

wherein the outer package body is made of a norbornene resin containing an amount of norbornene monomers, the amount being greater than 0 ppm by weight and less than or equal to 10000 ppm by weight.

2. The surface mount electronic component of claim 1 ,

wherein a plurality of the elements are laminated.

3. The surface mount electronic component of claim 2 ,

wherein at least parts of the plurality of anodes are bent or curved, and laminated on another anode.

4. The surface mount electronic component of claim 1 ,

wherein the outer package body is molded such that filler is included and 5000 ppm by weight or less of norbornene monomers are contained.

5. The surface mount electronic component of claim 1 ,

wherein in the outer package body, 65% by weight or more and 95% by weight or less of filler is included.

6. The surface mount electronic component of claim 1 ,

wherein the anode has a porous layer on a surface thereof, and a porosity of the porous layer is 50% or more and 80% or less.

7. The surface mount electronic component of claim 1 ,

wherein the anode has a porous layer on a surface thereof, and a mode of a diameter of a hole of the porous layer is 0.01 μm or more and 0.30 μm or less.

8. The surface mount electronic component of claim 7 ,

wherein a film thickness of the porous layer is 10 μm or more and 80 pm or less.

9. The surface mount electronic component of claim 6 ,

wherein a film thickness of the porous layer is 10 μm or more and 80 μm or less.

10. The surface mount electronic component of claim 1 ,

wherein the norbornene resin includes filler, and has a viscosity of 200 mPa·s or more and 1200 mPa·s or less before polymerization at 10° C. or more and 40° C. or less.

11. The surface mount electronic component of claim 1 ,

wherein the norbornene resin is polymerized at a temperature of 60° C. or more and 100° C. or less, and then post-cured at a temperature of 90° C. or more and 160° C. or less.

12. The surface mount electronic component of claim 1 ,

wherein the norbornene resin is post-cured at a temperature of a polymerization temperature or higher and at a temperature increased from the polymerization temperature by 20° C. or less, and then further post-cured at a temperature increased from the post-curing temperature by 20° C. or more and 70° C. or less.

13. A method for manufacturing a surface mount electronic component comprising an element including an anode and a cathode formed on a part of a surface of the anode via a dielectric substance, the method comprising:

electrically connecting the anode to an anode terminal;

electrically connecting the cathode to a cathode terminal;

fixing the element between an upper mold and a lower mold;

infusing a norbornene resin between the upper mold and the lower mold;

polymerizing the norbornene resin at a temperature of 60° C. or more and 100° C. or less; and

then post-curing the norbornene resin at 90° C. or more and 160° C. or less until the norbornene resin contains norbornene monomer in an amount greater than 0 ppm by weight and less than or equal to 10,000 ppm by weight.

14. A method for manufacturing a surface mount electronic component comprising an element including an anode and a cathode formed on a part of a surface of the anode via a dielectric substance, the method comprising:

electrically connecting the anode to an anode terminal;

electrically connecting the cathode to a cathode terminal;

fixing the element between an upper mold and a lower mold;

infusing a norbornene resin between the upper mold and the lower mold;

polymerizing the norbornene resin at a constant temperature;

carrying out post-curing at a polymerization temperature or higher and at a temperature increased from the polymerization temperature by 20° C. or less; and

then carrying out post-curing at a temperature increased from the post-curing temperature by 20° C. or more and 70° C. or less until the norbornene resin contains norbornene monomer in an amount greater than 0 ppm by weight and less than or equal to 10,000 ppm by weight.