IP Library Granted Patent US 8,421,451
Granted Patent B2
US 8,421,451 · App. 13/060,303 · Granted Apr 16, 2013

Assembly structure of current detection device

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Quick Facts
Patent No.
US 8,421,451
App. No.
13/060,303
Granted
Apr 16, 2013
Kind
B2
Abstract

An assembling structure is provided which is capable of greatly reducing the material cost, is easy-to-assemble, and can be made smaller. The sensor body is provided on a lower face with a protrusion, which comes into contact with an upper face of the busbar when the sensor body is mounted on the busbar. The busbar is provided with a through-hole passing through the busbar in a vertical direction. A leading end of the protrusion, which passes through the through-hole when the sensor body is mounted on the busbar, is heat-fused and adheres to the circumference of the through-hole.

Claims (7)

1. An assembly structure of a current detection device, comprising:

a busbar;

a sensor body formed by a heat-fusible resin material; and

a magnetic detection element provided on the sensor body to detect magnetism generated from the busbar,

wherein a protrusion is provided on a lower face of the sensor body and the lower face of the sensor body comes into contact with an upper face of the busbar when the sensor body is mounted on the busbar;

wherein the busbar is provided with a through-hole passing through the busbar in a vertical direction; and

wherein a leading end of the protrusion, which passes through the through-hole of the busbar when the sensor body is mounted on the busbar, is heat-fused and adheres to a circumference of the through-hole.

Assignments (2)
CHANGE OF ADDRESS Recorded Jun 5, 2023
From: YAZAKI CORPORATION
To: YAZAKI CORPORATION
Reel/Frame 063845/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2011
From: KAWAGUCHI, YASUNORI; MOCHIZUKI, TOSHIROU; ASAMI, TAKAYUKI
To: YAZAKI CORPORATION
Reel/Frame 025848/0562 →