Highly heat conductive polyimide film, highly heat conductive metal-clad laminate, and method for producing the same
View Patent ↗A highly heat conductive metal-clad laminate, which may be included in a highly heat conductive polyimide film, has a metal layer on one or both sides of an insulating layer which has a heat conductive filler-filled polyimide layer. The insulating layer of the highly heat conductive metal-clad laminate or the highly heat conductive polyimide film having the filler-filled polyimide layer is characterized in that the content of the heat conductive filler in the filler-filled polyimide layer is 20-80 wt %, the heat conductive filler contains a plate-like filler with an average length D L of 0.1-15 μm and a spherical filler with an average particle diameter D R of 0.05-10 μm, D L and D R satisfy the relationship D L >D R /2, no heat conductive filler of 30 μm or more is contained, and the coefficient of thermal expansion is in the range of 10-30 ppm/K.
1. A highly heat conductive metal-clad laminate having an insulating layer containing at least one layer of a heat conductive filler-filled polyimide resin and a metal layer on one or both sides of the insulating layer, wherein the content of the heat conductive filler in the layer of the filled polyimide resin is 20-80 wt %, the heat conductive filler contains a plate-like filler with an average length D L of 0.1-15 μm and a spherical filler with an average particle diameter D R of 0.05-10 μm, the average length D L and the average particle diameter D R satisfy the relationship D L >D R /2, no heat conductive filler of 30 μm or more is contained, the content of the spherical filler in the heat conductive filler is 25-70 wt %, the coefficient of thermal expansion of the insulating layer is in the range of 15-25 ppm/K, the thickness of the insulating layer is in the range of 10-50 μm, the thermal conductivity is 1.0 W/(m·K) or more in a thickness direction and 2.5 W/(m·K) or more in a planar direction of the insulating layer;
wherein the plate-like filler is at least one kind selected from the group of aluminum oxide and boron nitride and the spherical filler is at least one kind selected from the group of aluminum oxide, fused silica, and aluminum nitride.
2. The highly heat conductive metal-clad laminate as described in claim 1 wherein the sum of the heat conductive plate-like filler with a length of 9 μm or more and the heat conductive spherical filler with a particle diameter of 9 μm or more accounts for 50 wt % or less of the total heat conductive filler.
3. The highly beat conductive metal-clad laminate as described in claim 1 wherein the glass transition temperature of the polyimide resin constituting the insulating layer is 300° C. or above.
4. The highly heat conductive metal-clad laminate as described in claim 1 , wherein
the plate-like filler is at least one kind selected from the group of aluminum oxide and boron nitride and the spherical filler is at least one kind selected from the group of aluminum oxide, fused silica, and aluminum nitride,
the sum of the heat conductive plate-like filler with a length of 9 μm or more and the heat conductive spherical filler with a particle diameter of 9 μm or more accounts for 50 wt % or less of the total heat conductive filler, and
the glass transition temperature of the polyimide resin constituting the insulating layer is 300° C. or above.