Optoelectronic component, and method for the production of an optoelectronic component
View Patent ↗An optoelectronic component ( 1 ) is provided, having at least two connecters ( 2 ) for electrical contacting of the component ( 1 ), a housing body ( 3 ), in which the connecters ( 2 ) are embedded in places, a heat sink ( 4 ), which is connected to at least one connecter ( 2 ), wherein the housing body ( 3 ) is formed of a plastics material, the housing body ( 3 ) comprises an opening ( 30 ), in which the heat sink ( 4 ) is freely accessible in places, at least one optoelectronic semiconductor chip ( 5 ) is arranged in the opening ( 30 ) on the heat sink ( 4 ), and at least two of the connecters ( 2 ) each comprise a chip-end portion ( 2 c ), which faces the at least one optoelectronic semiconductor chip ( 5 ), wherein the chip-end portions ( 2 c ) of the at least two connecters ( 2 ) are arranged in a common plane.
1. An optoelectronic component comprising:
at least two connecters for electrical contacting of the component;
a housing body, in which the connecters are embedded in places; and
a heat sink, which is connected to at least one of the connecters and extends in a first plane, wherein
the housing body is formed of a plastics material,
the housing body comprises an opening, in which the heat sink is freely accessible in places,
at least one optoelectronic semiconductor chip is arranged in the opening on the heat sink, and
at least two of the connecters each comprise a chip-end portion, which faces the at least one optoelectronic semiconductor chip, wherein the chip-end portions of the at least two connecters are arranged on the heat sink in a second, common plane, which is different from the first plane.
2. The optoelectronic component according to claim 1 , wherein the plastics material of the housing body is epoxy resin or contains epoxy resin.
3. The optoelectronic component according to claim 1 , wherein the plastics material of the housing body is silicone or contains silicone.
4. The optoelectronic component according to claim 1 , wherein the heat sink comprises:
a top face, on which the at least one optoelectronic semiconductor chip is placed,
a bottom face, remote from the top face, and
a side face, which connects together the top face and the bottom face, wherein the side face is free of the plastics material of the housing body.
5. The optoelectronic component according to claim 1 , wherein the heat sink projects laterally beyond the housing body in a fastening portion of the heat sink.
6. The optoelectronic component according to claim 5 , wherein the heat sink comprises an opening in the fastening portion, which opening is intended for accommodating a fastening means.
7. The optoelectronic component according to claim 1 , wherein at least one of the connecters is configured in a connecting portion remote from its chip-end portion as a soldering lug.
8. The optoelectronic component according to claim 1 , wherein at least one of the connecters is configured in a connecting portion remote from its chip-end portion as a plug for a plug-and-socket connection.
9. The optoelectronic component according to claim 1 , wherein the at least one of the connecters extends in its connecting portion transversely of the fastening portion of the heat sink.
10. The optoelectronic component according to claim 1 , comprising at least three connecters.
11. The optoelectronic component according to claim 10 , wherein at least two connecters are welded together with the heat sink.
12. The optoelectronic component according to claim 1 , comprising at least four optoelectronic semiconductor chips.
13. The optoelectronic component according to claim 1 , wherein areas of the chip end portions are not covered by the housing material.
14. The optoelectronic component according to claim 1 , wherein an area of the opening is three or more times a total of chip areas of the at least one optoelectronic semiconductor chip.
15. The optoelectronic component according to claim 1 , wherein the at least one optoelectronic semiconductor chip is a semiconductor chip of a thin-film construction, and wherein a predominant part of electromagnetic radiation generated by the chip in operation leaves the chip solely through a top surface of the chip which faces away from the heatsink.