CIRCUIT ELEMENT
A circuit element 1 according to the present invention has a first element 2 and a second element 3 that are stacked, with a conductor 5 of the first element 2 contacting a conductor 7 of the second element 3 . Contact portions 9 are arranged such that the interval of a gap between adjacent contact portions 9 is less than or equal to one-quarter of a propagation wavelength of an electromagnetic wave. Such a configuration eliminates adverse effects due to electromagnetic waves, leaking into the interval portion between adjacent contact portions, and enables stable function formation.
1 . A circuit element comprising a plurality of laminated elements, a first element and a second element of which are stacked with a conductor of the first element contacting a conductor of the second element,
wherein the contact portions are arranged such that an interval of a gap between the contact portions that are adjacent is less than or equal to one-quarter of a propagation wavelength of an electromagnetic wave.
2 . The circuit element according to claim 1 , wherein a raised portion or a recessed portion is formed with respect to one or both of the first and second elements, and the raised portion contacts the other element.
3 . The circuit element according to claim 1 ,
wherein a raised portion is formed on the first element and a recessed portion is formed in the second element at a position corresponding to the raised portion of the first element, and
the raised portion is fitted into and contacts the recessed portion.
4 . The circuit element according to claim 1 ,
wherein the first element is a metal antenna adapter, and the second element is an antenna having a dielectric substrate that is covered with a conductor, and
the antenna is fitted into a fitting portion formed in the antenna adapter, and an end face of a raised portion formed on a lower surface of the antenna contacts a bottom face of the fitting portion of the antenna adapter.
5 . The circuit element according to claim 4 ,
wherein a propagation path for an electromagnetic wave is formed in the antenna adapter so as to be adjacent to the fitting portion, and
the raised portion of the antenna is disposed in a region adjacent to the propagation path when the antenna is fitted into the fitting portion Banned in the antenna adapter.
6 . The circuit element according to claim 1 , comprising stacked circuits that are formed using a molding technique.
7 . The circuit element according to claim 2 ,
wherein the first element is a metal antenna adapter, and the second element is an antenna having a dielectric substrate that is covered with a conductor, and
the antenna is fitted into a fitting portion formed in the antenna adapter, and an end face of a raised portion formed on a lower surface of the antenna contacts a bottom face of the fitting portion of the antenna adapter.
8 . The circuit element according to claim 3 ,
wherein the first element is a metal antenna adapter, and the second element is an antenna having a dielectric substrate that is covered with a conductor, and
the antenna is fitted into a fitting portion formed in the antenna adapter, and an end face of a raised portion formed on a lower surface of the antenna contacts a bottom face of the fitting portion of the antenna adapter.
9 . The circuit element according to claim 7 ,
wherein a propagation path for an electromagnetic wave is formed in the antenna adapter so as to be adjacent to the fitting portion, and
the raised portion of the antenna is disposed in a region adjacent to the propagation path when the antenna is fitted into the fitting portion formed in the antenna adapter.
10 . The circuit element according to claim 8 ,
wherein a propagation path for an electromagnetic wave is formed in the antenna adapter so as to be adjacent to the fitting portion, and
the raised portion of the antenna is disposed in a region adjacent to the propagation path when the antenna is fitted into the fitting portion formed in the antenna adapter.
11 . The circuit element according to claim 2 , comprising stacked circuits that are formed using a molding technique.
12 . The circuit element according to claim 3 , comprising stacked circuits that are formed using a molding technique.