IP Library Granted Patent US 8,707,781
Granted Patent B2
US 8,707,781 · App. 13/063,325 · Granted Apr 29, 2014

Sensor has combined in-plane and parallel-plane configuration

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Quick Facts
Patent No.
US 8,707,781
App. No.
13/063,325
Granted
Apr 29, 2014
Kind
B2
Abstract

A sensor senses a magnitude of a physical parameter of the sensor's environment. The sensor has first and second electrodes, and a material layer between them. The material has an electrical property, e.g., capacitance or resistance, whose value depends on the magnitude of the physical parameter. The first electrode is formed in a first layer, and the second electrode is formed in a second layer, different from the first layer. The first layer has a trench and an elevation next to the trench. The trench has a bottom wall and a side wall. The material is positioned on the bottom wall and on the side wall and on top of the elevation. The trench accommodates at least a part of the second electrode. The second electrode leaves exposed the material formed on top of the elevation.

Claims (45)

1. A device comprising a sensor for sensing a magnitude of a physical parameter of an environment of the sensor, wherein:

the sensor comprises a first electrode, a second electrode and a material between the first and second electrodes;

the material has an electrical property, whose value depends on the magnitude of the physical parameter;

the first electrode is formed in a first layer, and the second electrode is formed in a second layer different from the first layer;

the first layer includes elevation structures that define a trench in the first layer, the trench having a bottom wall and two side walls;

the material is positioned on the bottom wall and on the two side walls and on top of the elevation structures;

the trench accommodates at least a part of the second electrode; and

the second electrode does not substantially cover the material formed on top of the elevation structures.

2. The device of claim 1 , wherein the material is formed in multiple spatially separated bands across the trench and the elevation structures.

3. The device of claim 1 , wherein the material on top of the elevation structures has one or more grooves or holes.

4. The device of claim 1 , wherein:

the sensor is configured as a capacitive sensor;

the physical parameter is humidity; and

the material includes at least one of: a metal oxide, SiO 2 , SiC, a polyester, Polymethyl methacrylate, Benzocyclobutene, a polysulfate, cellulose acetate butyrate, porous silicon, and silicon nitride.

5. The device of claim 1 , comprising a transponder accommodating the sensor.

6. A device comprising a sensor for sensing a magnitude of a physical parameter of an environment of the sensor, wherein:

the sensor comprises a first electrode, a second electrode and a material between the first and second electrodes;

the material has an electrical property, whose value depends on the magnitude of the physical parameter;

the first electrode is formed in a first layer, and the second electrode is formed in a second layer different from the first layer;

the first layer has a trench and an elevation next to the trench;

the trench has a bottom wall and a side wall;

the material is positioned on the bottom wall and on the side wall and on top of the elevation;

the trench accommodates at least a part of the second electrode; and

the second electrode does not substantially cover the material formed on top of the elevation;

wherein the material is formed in multiple spatially separated bands across the trench and the elevation.

7. The device of claim 6 , wherein:

the sensor is configured as a capacitive sensor;

the physical parameter is humidity; and

the material includes at least one of: a metal oxide, SiO 2 , SiC, a polyester, Polymethyl methacrylate, Benzocyclobutene, a polysulfate, cellulose acetate butyrate, porous silicon, and silicon nitride.

8. The device of claim 6 , comprising a transponder accommodating the sensor.

9. A device comprising a sensor for sensing a magnitude of a physical parameter of an environment of the sensor, wherein:

the sensor comprises a first electrode, a second electrode and a material between the first and second electrodes;

the material has an electrical property, whose value depends on the magnitude of the physical parameter;

the first electrode is formed in a first layer, and the second electrode is formed in a second layer different from the first layer;

the first layer has a trench and an elevation next to the trench;

the trench has a bottom wall and a side wall;

the material is positioned on the bottom wall and on the side wall and on top of the elevation;

the trench accommodates at least a part of the second electrode; and

the second electrode does not substantially cover the material formed on top of the elevation;

wherein the material on top of the elevation has one or more grooves or holes.

10. The device of claim 9 , wherein:

the sensor is configured as a capacitive sensor;

the physical parameter is humidity; and

the material includes at least one of: a metal oxide, SiO 2 , SiC, a polyester, Polymethyl methacrylate, Benzocyclobutene, a polysulfate, cellulose acetate butyrate, porous silicon, and silicon nitride.

11. The device of claim 9 , comprising a transponder accommodating the sensor.

Assignments (12)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2015
From: NXP B.V.
To: AMS INTERNATIONAL AG
Reel/Frame 036015/0613 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2011
From: HUMBERT, AURELIE; MERZ, MATTHIAS
To: NXP, B.V.
Reel/Frame 026291/0750 →