IP Library Granted Patent US 8,181,354
Granted Patent B2
US 8,181,354 · App. 13/064,602 · Granted May 22, 2012

Inclination position sensor and inclination position sensor manufacturing method

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Quick Facts
Patent No.
US 8,181,354
App. No.
13/064,602
Granted
May 22, 2012
Kind
B2
Abstract

An inclination position sensor where, on a substrate on which wires are formed, plural electrodes electrically connected to the wires are disposed, a conductive ball that can simultaneously contact at least two of the plural electrodes is disposed, an enclosure that covers the plural electrodes and the conductive ball is disposed, and a circular arc is formed in places of the electrodes that contact the conductive ball.

Claims (20)

1. An inclination position sensor, comprising:

a laminated multilayer substrate having a concavo-convex portion, the concavo-convex portion having a side surface that includes a circular arc, and a further side surface that does not have a circular arc;

a plurality of inner wires, each extending to the side surface that does not include the circular arc;

a plurality of electrodes disposed on the surface of the side that includes the circular arc and on an upper surface of the concavo-convex portion, each electrode being electrically connected to a respective inner wire;

a conductive ball disposed in a concave portion of the substrate; and

a lid that forms an enclosure with the multilayer substrate and that covers the electrodes and the conductive ball.

2. The inclination position sensor recited in claim 1 , wherein said laminated multilayer substrate comprises first, second and third insulating substrates.

3. The inclination position sensor recited in claim 2 , wherein said first, second and third insulating substrates are low-temperature co-fired ceramic substrates.

4. The inclination position sensor recited in claim 3 , wherein said first, second and third insulating substrates are crystallized glass comprising a combination of alumina and borosilicate glass.

5. The inclination position sensor recited in claim 2 , wherein said first, second and third insulating substrates are crystallized glass comprising a combination of alumina and borosilicate glass.

6. The inclination position sensor recited in claim 1 , wherein each electrode is separated from an adjacent electrode by a space.

7. The inclination position sensor recited in claim 6 , wherein each pair of adjacent electrodes jointly has a circular arc shape that matches a circumference of the conductive ball.

8. The inclination position sensor recited in claim 6 , wherein the space is less than a diameter of the conductive ball.

9. The inclination position sensor recited in claim 1 , wherein there are eight electrodes spaced apart from each other, so that inclinations of 0, 45, 90, 135, 180, 225, 270 and 315 degrees can be detected.

10. The inclination position sensor recited in claim 1 , wherein said wires and said electrodes are comprised of Ag or Cu.

11. The inclination position sensor recited in claim 1 , wherein said lid is comprised of a same material as said substrate.

12. The inclination position sensor recited in claim 1 , wherein said lid is adhered to said substrate using a low-melting point glass or An-Su solder.

13. The inclination position sensor recited in claim 1 , further comprising an insulating liquid that fills the enclosure.

14. The inclination position sensor recited in claim 13 , wherein the insulating liquid comprises silicone oil.

15. The inclination position sensor recited in claim 13 , wherein the insulating liquid has a viscosity of about 10 mm 2 /s to about 100 mm 2 /s.

Assignments (2)
CHANGE OF NAME Recorded Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2011
From: OZAWA, NOBUO
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 027215/0761 →