Targeted liquid cooling for a system

1. A system comprising:

a plurality of servers each located on at least one circuit board, and each including a processor positioned on a first side of the at least one circuit board and a mass storage positioned on a second side of the at least one circuit board, the second side opposite to the first side; and

a liquid cooling system to provide a flow of coolant and including a first conduit having a first outlet to spray the coolant directly on the processor of a first one of the plurality of servers and a second conduit having a second outlet to spray the coolant directly on the mass storage of the first one of the plurality of servers.

2. The system of claim 1 , further comprising a sled having a plurality of interconnect slots at a top thereof to couple the at least one circuit board of each of the plurality of servers, wherein the first sever and a second server are coupled to the sled via a first interconnect slot.

3. The system of claim 1 , wherein the first conduit includes the first outlet adjacent to the processor of the first server and includes a second outlet adjacent to the mass storage of a second server.

4. The system of claim 3 , wherein the coolant comprises mineral oil.

5. The system of claim 4 , wherein the coolant is to be sprayed directly on the processor, the processor not having a heat sink adapted thereto.

6. The system of claim 5 , wherein the coolant is to be sprayed directly on a spindle of the mass storage.

7. The system of claim 1 , wherein the plurality of servers are cooled without fan cooling.

8. The system of claim 3 , further comprising a collection area at a bottom of the sled to collect the coolant after spraying.

9. The system of claim 8 , further comprising a recirculation system coupled to the collection area to filter the coolant, and return the coolant to the plurality of conduits.

10. The system of claim 9 , wherein the recirculation system includes a filtration mechanism, a pump, and a heat exchanger.

11. A system comprising:

a rack including a plurality of servers each implemented on a circuit board, each server including a processor, a memory, and a disk storage device; and

a plurality of conduits adapted about the plurality of servers, the conduits to carry a flow of liquid coolant, each of the conduits having at least one outlet to spray the liquid coolant directly onto a target component of a corresponding circuit board to provide cooling to the target component, wherein a first conduit is adjacent to a front side of a first circuit board and has a first outlet to spray the liquid coolant directly onto a first processor located on the front side of the first circuit board and a second conduit is adjacent to a rear side of the first circuit board and has a first outlet to spray the liquid coolant directly onto a first disk storage device located on the rear side of the first circuit board.

12. The system of claim 11 , further comprising a collection pan located below the rack to collect the liquid coolant and to direct the liquid coolant to a recirculator.

13. The system of claim 12 , wherein the recirculator includes a pump to recirculate the liquid coolant to the plurality of conduits.

14. The system of claim 11 , wherein the at least one outlet of the conduits includes at least one nozzle to direct the liquid coolant to the target component.

15. The system of claim 11 , wherein the rack does not provide for active air cooling.

16. The system of claim 11 , wherein at least one of the conduits has a first outlet to spray the liquid coolant on a first target component of a first circuit board and a second outlet to spray the liquid coolant on a second target component of a second circuit board.

17. A method comprising:

providing a flow of liquid coolant through a plurality of conduits positioned within a server system including a plurality of servers each implemented on a circuit board; and

spraying the liquid coolant via a first outlet mechanism of a first conduit onto a first target component of a first circuit board, the first outlet mechanism positioned in close proximity to the first target component, and spraying the liquid coolant via a second outlet mechanism of the first conduit onto a second target component of a second circuit board to directly cool the first and second target components to provide the directed spray cooling to the target components.

18. The method of claim 17 , further comprising collecting the sprayed liquid coolant via gravity in a collection area below the plurality of servers and providing the sprayed liquid coolant to a recirculation system for filtration, cooling and recirculation to the plurality of conduits.