OPTICAL RECORDING MEDIUM AND OPTICAL RECORDING METHOD
An optical recording medium having a good power margin during recording is provided. In an optical recording medium, a Cu recording layer that includes Cu as a main component, a first Si recording layer that is arranged adjacent to the cover layer side of the Cu recording layer and includes Si as a main component, and a second Si recording layer that is arranged adjacent to the substrate side of the Cu recording layer and includes Si as a main component, are stacked between the substrate and the cover layer.
1 . An optical recording medium comprising:
a substrate;
a cover layer;
a Cu recording layer that is arranged between the substrate and the cover layer and includes Cu as a main component;
a first Si recording layer that is arranged adjacent to a cover layer side of the Cu recording layer and includes Si as a main component; and
a second Si recording layer that is arranged adjacent to a substrate side of the Cu recording layer and includes Si as a main component.
2 . The optical recording medium according to claim 1 , wherein the second Si recording layer has a thickness T 2 that is set to 0 nm<T 2 ≦4 nm.
3 . The optical recording medium according to claim 2 , wherein the second Si recording layer has a thickness T 2 that is set to 1 nm≦T 2 ≦4 nm.
4 . The optical recording medium according to claim 1 , wherein the first Si recording layer has a thickness T 1 that is set to 0 nm<T 1 ≦8.5 nm.
5 . The optical recording medium according to claim 4 , wherein the first Si recording layer has a thickness T 1 that is set to 3.5 nm≦T 1 ≦8.5 nm.
6 . The optical recording medium according to claim 1 , wherein a thickness T 2 of the second Si recording layer is set to be smaller than a thickness T 1 of the first Si recording layer.
7 . The optical recording medium according to claim 4 , wherein the thickness T 2 of the second Si recording layer is set to be smaller than the thickness T 1 of the first Si recording layer.
8 . The optical recording medium according to claim 5 , wherein the thickness T 2 of the second Si recording layer is set to be smaller than the thickness T 1 of the first Si recording layer.
9 . The optical recording medium according to claim 1 , further comprising:
a first dielectric layer that is arranged adjacent to the cover layer side of the first Si recording layer; and
a second dielectric layer that is arranged adjacent to the substrate side of the second Si recording layer.
10 . The optical recording medium according to claim 4 , further comprising:
a first dielectric layer that is arranged adjacent to the cover layer side of the first Si recording layer; and
a second dielectric layer that is arranged adjacent to the substrate side of the second Si recording layer.
11 . The optical recording medium according to claim 5 , further comprising:
a first dielectric layer that is arranged adjacent to the cover layer side of the first Si recording layer; and
a second dielectric layer that is arranged adjacent to the substrate side of the second Si recording layer.
12 . The optical recording medium according to claim 6 , further comprising:
a first dielectric layer that is arranged adjacent to the cover layer side of the first Si recording layer; and
a second dielectric layer that is arranged adjacent to the substrate side of the second Si recording layer.
13 . The optical recording medium according to claim 7 , further comprising:
a first dielectric layer that is arranged adjacent to the cover layer side of the first Si recording layer; and
a second dielectric layer that is arranged adjacent to the substrate side of the second Si recording layer.
14 . The optical recording medium according to claim 8 , further comprising:
a first dielectric layer that is arranged adjacent to the cover layer side of the first Si recording layer; and
a second dielectric layer that is arranged adjacent to the substrate side of the second Si recording layer.
15 . An optical recording method for recording information by irradiating a laser beam on an optical recording medium having an information recording layer between a substrate and a cover layer, the method comprising:
providing, as the information recording layer, a Cu recording layer that includes Cu as a main component, a first Si recording layer that is arranged adjacent to a cover layer side of the Cu recording layer and includes Si as a main component, and a second Si recording layer that is arranged adjacent to a substrate side of the Cu recording layer and includes Si as a main component; and
chemically or physically modifying the Cu recording layer, the first Si recording layer, and the second Si recording layer simultaneously by heat from the laser beam.