IP Library Granted Patent US 8,736,727
Granted Patent B2
US 8,736,727 · App. 13/071,703 · Granted May 27, 2014

Solid-state imaging device and method for manufacturing the same, and electronic apparatus and camera module

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Quick Facts
Patent No.
US 8,736,727
App. No.
13/071,703
Granted
May 27, 2014
Kind
B2
Abstract

A solid-state imaging device includes a photoelectric conversion portion, a charge-receiving portion to which charges are transferred from the photoelectric conversion portion, and a light control film having a reverse tapered opening over the photoelectric conversion portion to reduce the intensity of diffracted light diffusing to regions other than the photoelectric conversion portion.

Claims (25)

1. A solid-state imaging device comprising:

a photoelectric conversion portion with a plurality of pixels with respective color components separated by color filters;

a charge-receiving portion to which charges are transferred from the photoelectric conversion portion; and

a light control film having reverse tapered openings over the photoelectric conversion portion, thereby reducing the intensity of diffracted light diffusing to regions other than the photoelectric conversion portion,

wherein,

a respective reverse tapered opening is provided for each pixel, and

the reverse tapered openings have different reverse taper angles according to the respective color components.

2. The solid-state imaging device according to claim 1 , wherein the light control film includes a light-shielding film.

3. The solid-state imaging device according to claim 1 , further comprising an optical waveguide over the photoelectric conversion portion, wherein the light control film is disposed at a lower end of the optical waveguide.

4. The solid-state imaging device according to claim 1 , wherein the reverse tapered opening has a shape having a plurality of steps.

5. The solid-state imaging device according to claim 1 , wherein the lower end of the reverse tapered opening has a smaller area than the photoelectric conversion portion.

6. An electronic apparatus comprising:

the solid-state imaging device as set forth in claim 1 ;

an optical system that guides incoming light to the photoelectric conversion portion of the solid-state imaging device; and

a signal processing circuit that processes a signal output from the solid-state imaging device.

7. A camera module comprising:

the solid-state imaging device as set forth in claim 1 ;

an optical system that guides incoming light to the photoelectric conversion portion of the solid-state imaging device; and

a signal processing circuit that processes a signal output from the solid-state imaging device.

8. A solid-state imaging device comprising:

a photoelectric conversion portion that generates a charge according to light incident thereon, the photoelectric conversion portion having a plurality of pixels with respective color components separated by color filters; and

a light-shielding film having a plurality of openings over the photoelectric conversion portion, each opening having a smaller area at one side of the light-shielding film through which light enters than at the other side,

wherein,

a respective reverse tapered opening is provided for each pixel, and

the reverse tapered openings have different reverse taper angles according to the respective color components.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 1, 2011
From: ANDO, ATSUHIRO
To: SONY CORPORATION
Reel/Frame 026367/0556 →