Backlight module with heat dissipating element and heat sink
View Patent ↗A backlight module includes a light guide plate, a back plate, a heat-dissipating element, a light-emitting element, and at least one high-performance heat sink. The heat-dissipating element is disposed adjacent to a light incident surface of the light guide plate, and the heat-dissipating element has a bottom portion and a side portion forming an angle with the bottom portion. The light-emitting element is disposed on one side of the heat-dissipating element facing the light guide plate. The high-performance heat sink is disposed on the back plate, one end of the high-performance heat sink overlaps the heat-dissipating element, and another end of the high-performance heat sink extends away from the light-emitting element.
1. A backlight module, comprising:
a light guide plate having a light incident surface;
a back plate disposed on a bottom side of the light guide plate;
a heat-conducting substrate disposed adjacent to the light incident surface, the heat-conducting substrate having a bottom portion and a side portion forming an angle with the bottom portion;
a light-emitting element disposed on one side of the heat-conducting substrate facing the light guide plate, wherein the light-emitting element is an LED light bar; and
at least one heat sink disposed in contact with the back plate, wherein the heat sink comprises one of a heat pipe, a heat column, and a heat spreader, the heat sink has at least one longitudinal body, the longitudinal body has a first end and a second end opposite the first end, the first end of the longitudinal body of the heat sink touches the heat-conducting substrate, and the second end of the longitudinal body of the heat sink does not touch the heat-conducting substrate and is not overlapped with the heat-conducting substrate.
2. The backlight module as claimed in claim 1 , wherein the LED light bar has a plurality of top-emission light-emitting diodes and is attached to the side portion of the heat-conducting substrate.
3. The backlight module as claimed in claim 1 , wherein the LED light bar has a plurality of side-emission light-emitting diodes and is attached to the bottom portion of the heat-conducting substrate.
4. The backlight module as claimed in claim 1 , wherein the heat-conducting substrate has a T-shaped cross-section or an L-shaped cross-section.