RF front-end module
View Patent ↗A front-end module (FEM) includes first and second frequency band power amplifiers (PA), first and second frequency band receiver-transmitter (RX-TX) isolation modules, and an antenna interface unit. The PAs are operable to amplify first and second frequency band outbound RF signals, respectively. The RX-TX isolation modules are operable to isolate first and second frequency band inbound RF signals from first and second frequency band outbound RF signals in accordance with first and second frequency band isolation tuning signal, respectively. The antenna interface unit is operably tuned in accordance with an antenna interface tuning signal to output at least one of the first frequency band outbound RF signal and the second frequency band outbound RF signal and to receive at least one of the first frequency band inbound RF signal and the second frequency band inbound RF signal.
1. A front-end module (FEM) comprises:
a first frequency band power amplifier (PA) configured to amplify a first frequency band outbound radio frequency (RF) signal;
a second frequency band PA configured to amplify a second frequency band outbound RF signal;
a first frequency band receiver-transmitter (RX-TX) isolation module configured to isolate a first frequency band inbound RF signal from the first frequency band outbound RF signal in accordance with a first frequency band isolation tuning signal;
a second frequency band RX-TX isolation module configured to isolate a second frequency band inbound RF signal from the second frequency band outbound RF signal in accordance with a second frequency band isolation tuning signal; and
an antenna interface unit operably tuned in accordance with an antenna interface tuning signal to:
output at least one of the first frequency band outbound RF signal and the second frequency band outbound RF signal; and
receive at least one of the first frequency band inbound RF signal and the second frequency band inbound RF signal,
wherein each of the first and second RX-TX isolation modules comprises:
a duplexer configured to:
isolate the first frequency band inbound RF signal from the first frequency outbound RF signal; or
isolate the second frequency band inbound RF signal from the second frequency outbound RF signal;
a balance network configured to adjust impedance of the first or second RX-TX isolation module based on the first or second frequency band isolation tuning signal; and
a common mode sensing circuit configured to generate a transmit leakage indication signal, wherein the first or second frequency band isolation tuning signal is generated based on the transmit leakage indication signal.
2. The FEM of claim 1 , wherein the duplexer comprises:
a transformer having two primary windings and a secondary winding, wherein the two primary windings are serially connected, a common node of the serially connected primary windings is coupled to the first or second PA, another node of a first of the two primary windings is coupled to the antenna interface unit, and another node of a second of the primary windings is coupled to the balance network, and wherein the secondary winding is coupled to a low noise amplifier port.
3. The FEM of claim 1 , wherein the antenna interface unit comprises:
a first frequency band antenna tuning unit operably tuned in accordance with the antenna interface tuning signal to provide a first desired antenna matching when the first frequency inbound RF signal is received or when the first frequency outbound RF signal is transmitted;
a second frequency band antenna tuning unit operably tuned in accordance with the antenna interface tuning signal to provide a second desired antenna matching when the second frequency inbound RF signal is received or when the second frequency outbound RF signal is transmitted; and
a frequency band switch operably coupled to:
couple the first frequency band antenna tuning unit to an antenna when the first frequency inbound RF signal is received or when the first frequency outbound RF signal is transmitted; and
couple the second frequency band antenna tuning unit to the antenna when the second frequency inbound RF signal is received or when the second frequency outbound RF signal is transmitted.
4. The FEM of claim 1 , wherein the antenna interface unit comprises:
an antenna tuning unit operably tuned in accordance with the antenna interface tuning signal to:
provide a first desired antenna matching when the first frequency inbound RF signal is received or when the first frequency outbound RF signal is transmitted; and
provide a second desired antenna matching when the second frequency inbound RF signal is received or when the second frequency outbound RF signal is transmitted.
5. The FEM of claim 1 further comprises:
a first frequency band impedance operably coupled to an output of the first frequency band PA;
a first frequency band filter operably coupled to the first frequency band impedance;
first frequency band RX-TX isolation by-pass switches operably coupled to:
in a first mode, couple the first frequency band filter to the first frequency band RX-TX isolation module and couple the first frequency band RX-TX isolation module to the antenna interface unit; and
in a second mode, couple the first frequency band filter to the antenna interface unit;
a second frequency band impedance operably coupled to an output of the second frequency band PA;
a second frequency band filter operably coupled to the second frequency band impedance; and
second frequency band RX-TX isolation by-pass switches operably coupled to:
in a third mode, couple the second frequency band filter to the second frequency band RX-TX isolation module and couple the second frequency band RX-TX isolation module to the antenna interface unit; and
in a fourth mode, couple the second frequency band filter to the antenna interface unit.
6. The FEM of claim 1 further comprises:
a first frequency band impedance operably coupled to an output of the first frequency band PA;
a first frequency band filter;
a first frequency band RX-TX isolation by-pass switches operably coupled to:
in a first mode, couple the first frequency band impedance to the first frequency band RX-TX isolation module and couple the first frequency band RX-TX isolation module to the antenna interface unit; and
in a second mode, couple the first frequency band filter to the first frequency band impedance and to the antenna interface unit;
a second frequency band impedance operably coupled to an output of the second frequency band PA;
a second frequency band filter; and
a second frequency band RX-TX isolation by-pass switches operably coupled to:
in a third mode, couple the second frequency band impedance to the second frequency band RX-TX isolation module and couple the second frequency band RX-TX isolation module to the antenna interface unit; and
in a fourth mode, couple the second frequency band filter to the second frequency band impedance and to the antenna interface unit.
7. The FEM of claim 1 further comprises:
an FEM control signal port configured to receive at least one of the first frequency band isolation tuning signal, the second frequency band isolation tuning signal, and the antenna interface tuning signal; and
an FEM monitor port configured to output at least one of a first frequency band transmit leakage indication signal and a second frequency band transmit leakage indication signal.
8. A wireless communication device chip set comprises:
a front-end module (FEM) IC including:
a first frequency band power amplifier (PA) configured to amplify a first frequency band outbound radio frequency (RF) signal;
a second frequency band PA configured to amplify a second frequency band outbound RF signal;
a first frequency band receiver-transmitter (RX-TX) isolation module configured to isolate a first frequency band inbound RF signal from the first frequency band outbound RF signal in accordance with a first frequency band isolation tuning signal;
a second frequency band RX-TX isolation module configured to isolate a second frequency band inbound RF signal from the second frequency band outbound RF signal in accordance with a second frequency band isolation tuning signal; and
an antenna interface unit operably tuned in accordance with an antenna interface tuning signal to:
output at least one of the first frequency band outbound RF signal and the second frequency band outbound RF signal; and
receive at least one of the first frequency band inbound RF signal and the second frequency band inbound RF signal; and
a first integrated circuit (IC) including:
a first low noise amplifier (LNA) configured to amplify the first frequency band inbound RF signal;
a second LNA configured to amplify the second frequency band inbound RF signal; and
a processing module configured to:
generate the first frequency band isolation tuning signal;
generate the second frequency band isolation tuning signal; and
generate the antenna interface tuning signal,
wherein at least one of the first and second RX-TX isolation modules includes:
a duplexer configured to:
isolate the first frequency band inbound RF signal from the first frequency outbound RF signal; or
isolate the second frequency band inbound RF signal from the second frequency outbound RF signal;
a balance network configured to adjust impedance of the first or second RX-TX isolation module based on the first or second frequency band isolation tuning signal; and
a common mode sensing circuit configured to generate a transmit leakage indication signal; and
wherein the processing module generates the first or second frequency band isolation tuning signal based on the transmit leakage indication signal.
9. The wireless communication device chip set of claim 8 , wherein the duplexer comprises:
a transformer having two primary windings and a secondary winding, wherein the two primary windings are serially connected, a common node of the serially connected primary windings is coupled to the first or second PA, another node of a first of the two primary windings is coupled to the antenna interface unit, and another node of a second of the primary windings is coupled to the balance network, and wherein the secondary winding is coupled to a low noise amplifier port.
10. The wireless communication device chip set of claim 8 further comprises:
the antenna interface unit including:
a first frequency band antenna tuning unit operably tuned in accordance with the antenna interface tuning signal to provide a first desired antenna matching when the first frequency inbound RF signal is received or when the first frequency outbound RF signal is transmitted;
a second frequency band antenna tuning unit operably tuned in accordance with the antenna interface tuning signal to provide a second desired antenna matching when the second frequency inbound RF signal is received or when the second frequency outbound RF signal is transmitted; and
a frequency band switch operably coupled to:
couple the first frequency band antenna tuning unit to an antenna when the first frequency inbound RF signal is received or when the first frequency outbound RF signal is transmitted; and
couple the second frequency band antenna tuning unit to the antenna when the second frequency inbound RF signal is received or when the second frequency outbound RF signal is transmitted; and
wherein the processing module is further configured to:
generate the antenna interface tuning signal to provide the first desired antenna matching in accordance with first frequency band parameters of the FEM IC when the first frequency inbound RF signal is received or when the first frequency outbound RF signal is transmitted; and
generate the antenna interface tuning signal to provide the second desired antenna matching in accordance with second frequency band parameters of the FEM IC when the second frequency inbound RF signal is received or when the second frequency outbound RF signal is transmitted.
11. The wireless communication device chip set of claim 8 further comprises:
the antenna interface unit including:
an antenna tuning unit operably tuned in accordance with the antenna interface tuning signal to:
provide a first desired antenna matching when the first frequency inbound RF signal is received or when the first frequency outbound RF signal is transmitted; and
provide a second desired antenna matching when the second frequency inbound RF signal is received or when the second frequency outbound RF signal is transmitted; and
wherein the processing module is further configured to:
generate the antenna interface tuning signal to provide the first desired antenna matching in accordance with first frequency band parameters of the FEM IC when the first frequency inbound RF signal is received or when the first frequency outbound RF signal is transmitted; and
generate the antenna interface tuning signal to provide the second desired antenna matching in accordance with second frequency band parameters of the FEM IC when the second frequency inbound RF signal is received or when the second frequency outbound RF signal is transmitted.
12. The wireless communication device chip set of claim 8 further comprises:
the FEM IC further including:
a first frequency band impedance operably coupled to an output of the first frequency band PA;
a first frequency band filter operably coupled to the first frequency band impedance;
first frequency band RX-TX isolation by-pass switches operably coupled to:
in a first mode, couple the first frequency band filter to the first frequency band RX-TX isolation module and couple the first frequency band RX-TX isolation module to the antenna interface unit; and
in a second mode, couple the first frequency band filter to the antenna interface unit;
a second frequency band impedance operably coupled to an output of the second frequency band PA;
a second frequency band filter operably coupled to the second frequency band impedance; and
second frequency band RX-TX isolation by-pass switches operably coupled to:
in a third mode, couple the second frequency band filter to the second frequency band RX-TX isolation module and couple the second frequency band RX-TX isolation module to the antenna interface unit; and
in a fourth mode, couple the second frequency band filter to the antenna interface unit; and
wherein the processing module is further configured to:
enable the first mode when gain adjustment of the first frequency band outbound RF signal is desired;
enable the second mode when the gain adjustment of the first frequency band outbound RF signal is not desired;
enable the third mode when gain adjustment of the second frequency band outbound RF signal is desired; and
enable the fourth when the gain adjustment of the second frequency band outbound RF signal is not desired.
13. The wireless communication device chip set of claim 8 further comprises:
the FEM IC further including:
a first frequency band impedance operably coupled to an output of the first frequency band PA;
a first frequency band filter;
first frequency band RX-TX isolation by-pass switches operably coupled to:
in a first mode, couple the first frequency band impedance to the first frequency band RX-TX isolation module and couple the first frequency band RX-TX isolation module to the antenna interface unit; and
in a second mode, couple the first frequency band filter to the first frequency band impedance and to the antenna interface unit;
a second frequency band impedance operably coupled to an output of the second frequency band PA;
a second frequency band filter; and
second frequency band RX-TX isolation by-pass switches operably coupled to:
in a third mode, couple the second frequency band impedance to the second frequency band RX-TX isolation module and couple the second frequency band RX-TX isolation module to the antenna interface unit; and
in a fourth mode, couple the second frequency band filter to the second frequency band impedance and to the antenna interface unit; and
wherein the processing module is further configured to:
enable the first mode when gain adjustment of the first frequency band outbound RF signal is desired;
enable the second when the gain adjustment of the first frequency band outbound RF signal is not desired;
enable the third mode when gain adjustment of the second frequency band outbound RF signal is desired; and
enable the fourth when the gain adjustment of the second frequency band outbound RF signal is not desired.
14. The wireless communication device chip set of claim 8 , wherein the first IC further comprises:
a surface acoustic wave (SAW)-less receiver section that includes the first and second frequency band LNAs;
a SAW-less transmitter section operably coupled to generate the first and second frequency band outbound RF signals.
15. A wireless communication device comprising:
a front-end module (FEM) IC including:
a first frequency band power amplifier (PA) configured to amplify a first frequency band outbound radio frequency (RF) signal;
a first frequency band receiver-transmitter (RX-TX) isolation module configured to isolate a first frequency band inbound RF signal from the first frequency band outbound RF signal in accordance with a first frequency band isolation tuning signal;
a first frequency band impedance coupled to an output of the first frequency band PA;
a first frequency band filter coupled to the first frequency band impedance;
first frequency band RX-TX isolation by-pass switches configured to:
in a first mode, couple the first frequency band filter to the first frequency band RX-TX isolation module and couple the first frequency band RX-TX isolation module to an antenna interface unit; and
in a second mode, couple the first frequency band filter to the antenna interface unit;
a second frequency band PA configured to amplify a second frequency band outbound RF signal;
a second frequency band RX-TX isolation module configured to isolate a second frequency band inbound RF signal from the second frequency band outbound RF signal in accordance with a second frequency band isolation tuning signal; and
a second frequency band impedance coupled to an output of the second frequency band PA;
a second frequency band filter operably coupled to the second frequency band impedance; and
second frequency band RX-TX isolation by-pass switches operably coupled to:
in a third mode, couple the second frequency band filter to the second frequency band RX-TX isolation module and couple the second frequency band RX-TX isolation module to the antenna interface unit; and
in a fourth mode, couple the second frequency band filter to the antenna interface unit; and
a processing module configured to:
enable the first mode when gain adjustment of the first frequency band outbound RF signal is desired;
enable the second mode when the gain adjustment of the first frequency band outbound RF signal is not desired;
enable the third mode when gain adjustment of the second frequency band outbound RF signal is desired; and
enable the fourth mode when the gain adjustment of the second frequency band outbound RF signal is not desired.
16. The wireless communication device of claim 15 , further comprising:
a first low noise amplifier (LNA) configured to amplify the first frequency band inbound RF signal;
a second LNA configured to amplify the second frequency band inbound RF signal; and
a processing module configured to:
generate the first frequency band isolation tuning signal;
generate the second frequency band isolation tuning signal; and
generate an antenna interface tuning signal.
17. The wireless communication device of claim 16 , further comprising:
a surface acoustic wave (SAW)-less receiver section that includes the first and second frequency band LNAs; and
a SAW-less transmitter section operably coupled to generate the first and second frequency band outbound RF signals.
18. The wireless communication device of claim 15 , further comprising:
an antenna interface unit including:
an antenna tuning unit operably tuned in accordance with the antenna interface tuning signal to:
provide a first desired antenna matching when the first frequency inbound RF signal is received or when the first frequency outbound RF signal is transmitted; and
provide a second desired antenna matching when the second frequency inbound RF signal is received or when the second frequency outbound RF signal is transmitted; and
wherein the processing module is further configured to:
generate the antenna interface tuning signal to provide the first desired antenna matching in accordance with first frequency band parameters of the FEM IC when the first frequency inbound RF signal is received or when the first frequency outbound RF signal is transmitted; and
generate the antenna interface tuning signal to provide the second desired antenna matching in accordance with second frequency band parameters of the FEM IC when the second frequency inbound RF signal is received or when the second frequency outbound RF signal is transmitted.
19. The wireless communication device of claim 15 :
wherein at least one of the first and second RX-TX isolation modules includes:
a duplexer configured to:
isolate the first frequency band inbound RF signal from the first frequency outbound RF signal; or
isolate the second frequency band inbound RF signal from the second frequency outbound RF signal;
a balance network configured to adjust impedance of the first or second RX-TX isolation module based on the first or second frequency band isolation tuning signal; and
a common mode sensing circuit configured to generate a transmit leakage indication signal; and
wherein the processing module generates the first or second frequency band isolation tuning signal based on the transmit leakage indication signal.
20. The wireless communication device of claim 19 , wherein the duplexer comprises a transformer having two primary windings and a secondary winding, wherein the two primary windings are serially connected, a common node of the serially connected primary windings is coupled to the first or second PA, another node of a first of the two primary windings is coupled to the antenna interface unit, and another node of a second of the primary windings is coupled to the balance network, and wherein the secondary winding is coupled to a low noise amplifier port.