Moldable ear sensor
The present disclosure relates to sensors for use on a patient's ear. The sensors as provided may include a moldable member, such as a putty. The moldable member may be molded in place to affix the optical components of the sensor to a patient's ear tissue. For example, the moldable member may be sculpted around a curvature of a patient's earlobe. In particular embodiments, the moldable member may be activated, e.g., hardened, by exposure to particular temperatures or by exposure to light.
1. A sensor comprising:
a sensor body comprising a first portion and a second portion, wherein the first portion and the second portion are configured to be applied to opposing sides of an ear;
an emitter disposed on the first portion and configured to emit light into a tissue;
a light detector disposed on the first portion or the second portion and configured to receive the light from the tissue; and
a moldable member configured to be molded around at least part of the emitter and at least part of the detector and to retain the emitter and the detector at a measurement site when the sensor is applied to the ear, wherein the moldable member is configured to directly contact the tissue and to conform to the tissue when the sensor is applied to the ear.
2. The sensor, as set forth in claim 1 , wherein the sensor comprises a release layer disposed on the moldable member such that the moldable member is between the sensor body and the release layer.
3. The sensor, as set forth in claim 1 , wherein the moldable member comprises a putty.
4. The sensor, as set forth in claim 1 , wherein the moldable member comprises a room temperature vulcanizing silicone.
5. The sensor, as set forth in claim 1 , wherein the moldable member is configured to harden or cure when exposed to a particular wavelength of light.
6. The sensor, as set forth in claim 1 , wherein the moldable member has a hardness of 20 Shore OO or less.
7. The sensor, as set forth in claim 1 , wherein the moldable member is adhesive.
8. The sensor, as set forth in claim 1 , wherein the sensor comprises a pulse oximetry sensor.
9. The sensor of claim 1 , wherein the moldable member is configured to be removable from the sensor.
10. An ear sensor comprising:
an electrical connector coupled to an emitter adapted to transmit light into a tissue and a light detector configured to receive the light from the tissue; and
a moldable member configured to be molded around a portion of the electrical connector such that the moldable member covers at least a portion of the electrical connector and affixes at least a portion of the electrical connector to the tissue when the ear sensor is applied to a patient, and wherein the moldable member is configured to directly contact the tissue when the ear sensor is applied to the patient.
11. The ear sensor, as set forth in claim 10 , wherein the moldable member partially surrounds the emitter and the detector.
12. The ear sensor, as set forth in claim 10 , wherein the moldable member comprises a dental impression material.
13. The ear sensor, as set forth in claim 10 , wherein the sensor comprises a backing layer disposed on a surface of the moldable material.
14. The ear sensor, as set forth in claim 10 , wherein the electrical connector comprises a flexible circuit and wherein the moldable material is disposed on a non-tissue contacting side of the flexible circuit.
15. A method comprising:
applying an emitter adapted to transmit light into a patient's tissue and a light detector configured to receive the transmitted light from the tissue onto an ear; and
molding a putty over and around the emitter and the detector to affix the emitter and the detector onto the ear, wherein the putty is configured to directly contact the patient's tissue when applied to the ear.
16. The method of claim 15 , comprising molding the putty around at least a portion of an electrical connector coupled to the emitter and the detector to affix the portion of the electrical connector to the ear.
17. The method of claim 15 , wherein molding the putty around the emitter and the detector comprises molding the putty around an earlobe.
18. The method of claim 15 , wherein molding the putty around the emitter and the detector comprises molding the putty around a helix of the ear.
19. The method of claim 15 , comprising exposing the putty to a temperature at which the putty is configured to harden.
20. The method of claim 15 , comprising exposing the putty to a predetermined wavelength of light configured to harden the putty.