Systems and methods for enhancing reliability of MEMS devices
View Patent ↗A micro-electromechanical system (MEMS) device that in one embodiment includes at least two MEMS switches coupled to each other in a back-to-back configuration. The first and second suspended elements corresponding to first and second MEMS switches are electrically coupled. Further, first and second contacts corresponding to the first and second MEMS switches are configured such that a differential voltage between the second suspended element and the second contact is approximately equal to a differential voltage between the first suspended element and the first contact. The MEMS device includes at least one actuator coupled to one or more of the first and second suspended elements to actuate one or more of the first and the second suspended elements. In one example, the MEMS device includes one or more passive elements coupled to one or more of the first and second MEMS switches.
1. A micro-electromechanical system (MEMS) device, comprising:
at least two MEMS switches coupled to each other in a back-to-back configuration;
a first suspended element corresponding to the first MEMS switch electrically coupled to a second suspended element corresponding to the second MEMS switch;
a first contact corresponding to the first MEMS switch and a second contact corresponding to the second MEMS switch configured such that a differential voltage between the second suspended element and the second contact is approximately equal to a differential voltage between the first suspended element and the first contact;
at least one actuator coupled to one or more of the first suspended element and the second suspended element to actuate one or more of the first suspended element and the second suspended element; and
one or more passive elements coupled to one or more of the first and second MEMS switches, wherein the one or more passive elements are configured to reduce energy transfer during state transition of the MEMS device.
2. The MEMS device of claim 1 , wherein the one or more passive elements comprise one or more inductors coupled to the MEMS device in parallel, one or more resistors coupled to the MEMS device in parallel, or combinations thereof.
3. The MEMS device of claim 1 , wherein the one or more passive elements comprise one or more inductors coupled to the MEMS device in parallel.
4. The MEMS device of claim 1 , wherein the one or more passive elements comprise one or more resistors coupled to the MEMS device in parallel.
5. The MEMS device of claim 1 , wherein one or more characteristics corresponding to the one or more passive elements are selected based on peak voltage, peak current, desired voltage rating, energy absorption characteristics, magnetic characteristics, parasitic effects or combinations thereof, corresponding to the MEMS device.
6. The MEMS device of claim 5 , wherein the one or more characteristics corresponding to the one or more passive elements comprise shape, size, material, or combinations thereof.
7. The MEMS device of claim 1 coupled to one or more of transmit and receive circuits, magnetic resonance (MR) coils, a high isolation environment and a radio-frequency blocking path, wherein the impedance of the MEMS device varies as a function of a corresponding frequency.
8. The MEMS device of claim 7 , wherein the one or more MR coils are receive coils, transmit coils, or a combination thereof.
9. The MEMS device of claim 1 , wherein the one or more passive elements are coupled to one or more of the first suspended element, the first contact, the second suspended element and the second contact such that the one or more passive elements is configured to increase an impedance relative to the MEMS switches for radio frequency components at high frequency values and to decrease an impedance relative to the MEMS switches for the radio frequency components at low frequency values.
10. The MEMS device of claim 1 , wherein the first contact is electrically coupled to the first suspended element and the second contact is electrically coupled to the second suspended element when actuated by the actuator.
11. A micro-electromechanical system (MEMS) device, comprising:
at least two MEMS switches coupled to each other in a back-to-back configuration, wherein the impedance of the MEMS device varies as a function of frequency, wherein the MEMS device is coupled to at least one transmit and receive circuit; and
one or more passive elements coupled to at least one of the MEMS switches to receive a transfer of electrical energy from the at least one of the MEMS switches to reduce coupling of the electrical energy across the MEMS switches during state transition of the MEMS device.
12. The MEMS device of claim 11 , wherein the transmit and receive circuit comprises transmit magnetic resonance (MR) coils, receive MR coils, or a combination thereof.
13. The MEMS device of claim 11 , wherein one or more of the plurality of MEMS switches coupled to each other in a back-to-back configuration comprise:
a first suspended element electrically coupled to a second suspended element;
a first contact and a second contact configured such that a differential voltage between the second suspended element and the second contact is approximately equal to a differential voltage between the first suspended element and the first contact; and
an actuator coupled to one or more of the first suspended element and the second suspended element to actuate one or more of the first suspended element and the second suspended element.
14. The MEMS device of claim 11 , wherein the one or more passive elements are coupled to at least one of the plurality of MEMS switches such that the one or more passive elements is configured to increase an impedance relative to the MEMS switches for radio frequency components above a threshold frequency and one or more passive elements is configured to decrease an impedance relative to the MEMS switches for the radio frequency components below the threshold frequency.
15. A method of improving reliability of a MEMS device in a transmit and receive circuit, comprising:
coupling a plurality of MEMS switches to each other in a back-to-back configuration;
providing one or more passive elements; and
coupling the one or more passive elements to at least one of the plurality of MEMS switches to receive a transfer of electrical energy from the at least one of the plurality of MEMS switches to reduce coupling of the electrical energy across the MEMS switches during state transition of at least one of the plurality of MEMS switches.
16. The method of claim 15 , further comprising coupling the one or more passive elements to the one or more MEMS switches such that the one or more passive elements block radio frequency components above a threshold frequency and short the radio frequency components below the threshold frequency.
17. The method of claim 15 , further comprising selecting one or more characteristics corresponding to the one or more passive elements based on peak voltage, peak current, desired voltage rating, energy absorption characteristics, or combinations thereof, corresponding to the MEMS switches, wherein the one or more characteristics comprise shape, size, material, magnetic characteristics, parasitic effects, or combinations thereof.
18. A micro-electromechanical system (MEMS) device, comprising:
at least two MEMS switches electrically coupled to each other, wherein the MEMS switches are configured in a back-to-back configuration having a single anchor mechanically coupling actuator elements of the MEMS switches;
a single gate driver electrically coupled to the MEMS switches to change a switch state of the MEMS switches; and
a passive bypass circuit comprising a plurality of passive elements coupled to the MEMS switches, wherein one end of the passive elements is coupled to a contact of the respective MEMS switches and the other end of the passive elements is coupled to a beam of the respective MEMS switches, wherein the passive elements are configured to reduce energy transfer during the change of the switch state of the MEMS switches, and wherein the passive elements are independent of the switch state.
19. The MEMS device of claim 18 , wherein the passive elements are resistors.
20. The MEMS device of claim 18 , wherein the one or more passive elements comprise one or more inductors coupled to the MEMS device in parallel.