IP Library Granted Patent US 8,288,793
Granted Patent B2
US 8,288,793 · App. 13/078,497 · Granted Oct 16, 2012

LED package having a lead frame

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Quick Facts
Patent No.
US 8,288,793
App. No.
13/078,497
Granted
Oct 16, 2012
Kind
B2
Abstract

The present invention relates to an LED package including a lead frame including a chip attaching portion with at least one LED chip attached thereto and a plurality of terminal portions each having a width narrower than the chip attaching portion, and a housing for supporting the lead frame. The plurality of terminal portions include at least one first terminal portion extending from a portion of a width of the chip attaching portion, and a plurality of second terminal portions spaced apart from the chip attaching portion.

Claims (32)

1. An LED package, comprising:

a chip attaching portion having a first side and a second side opposite thereto;

at least one LED chip attached to the chip attaching portion;

a first pair of terminal portions disposed at the first side of the chip attaching portion, the first pair of terminal portions being completely separated from the chip attaching portion and from each other;

a second pair of terminal portions disposed at the second side of the chip attaching portion, at least one of the second pair of terminal portions being integrally connected to the chip attaching portion; and

a housing having the chip attaching portion therein, the housing allowing the first pair of terminal portions to extend to the outside through a side thereof, the housing allowing the second pair of terminal portions to extend to the outside through the opposite side thereof in the opposite direction,

wherein each terminal portion comprises a bent portion arranged near an external surface of the housing, and the bent portion comprises a V-shaped notch.

2. The LED package according to claim 1 , wherein all of the second pair of terminal portions are integrally connected to the chip attaching portion.

3. The LED package according to claim 1 , wherein one of the second pair of terminal portions is integrally connected to the chip attaching portion, the other one of the second pair of terminal portions is separated from the chip attaching portion.

4. The LED package according to claim 3 , wherein the chip attaching portion comprises an indented region, and wherein the other one of the second pair of terminal portions is disposed in the indented region.

5. The LED package according to claim 1 , wherein the first pair of terminal portions, the second pair of terminal portions and the chip attaching portion have upper faces substantially flush with each other in the housing.

6. The LED package according to claim 1 , wherein the chip attaching portion, the first pair of terminal portions and the second pair of terminal portions are formed of a single metal plate.

7. The LED package according to claim 1 , wherein the housing comprises a cavity for exposing portions of the first pair of terminal portions and the chip attaching portion to the upper side, a region in which the cavity is formed in the housing has the shortest interval between the first pair of terminal portions.

8. The LED package according to claim 1 , wherein the chip attaching portion has a substantially quadrangular shape.

9. The LED package according to claim 1 , wherein at least one of the terminal portions comprises a moisture shield arranged on a surface thereof, wherein the moisture shield comprises a wall protruding from the surface of the terminal portion and contacting the housing.

10. The LED package as claimed in claim 1 , wherein the housing comprises a cavity for exposing portions of the first pair of terminal portions, the second pair of terminal portions and the chip attaching portion to the upper side, a moisture shielding wall contacting an encapsulant and arranged in an inner wall of the cavity.

11. A light-emitting diode (LED) package, comprising:

a chip attaching portion having a first side and a second side opposite thereto;

at least one LED chip attached to the chip attaching portion;

a first pair of terminal portions disposed at the first side of the chip attaching portion, the first pair of terminal portions being completely separated from the chip attaching portion and from each other;

a second pair of terminal portions disposed at the second side of the chip attaching portion, at least one of the second pair of terminal portions being integrally connected to the chip attaching portion; and

a housing having the chip attaching portion therein, the housing allowing the first pair of terminal portions to extend to the outside through a side thereof, the housing allowing the second pair of terminal portions to extend to the outside through the opposite side thereof in the opposite direction,

wherein each terminal portion comprises a width approximately half that of the chip attaching portion.

12. The LED package according to claim 11 , wherein all of the second pair of terminal portions are integrally connected to the chip attaching portion.

13. The LED package according to claim 11 , wherein one of the second pair of terminal portions is integrally connected to the chip attaching portion, the other one of the second pair of terminal portions is separated from the chip attaching portion.

14. The LED package according to claim 13 , wherein the chip attaching portion comprises a cut-away region depressed inwards, and wherein the other one of the second pair of terminal portions expands in the depressed region.

15. The LED package according to claim 11 , wherein the first pair of terminal portions, the second pair of terminal portions and the chip attaching portion have upper faces substantially flush with each other in the housing.

16. The LED package according to claim 11 , wherein the chip attaching portion, the first pair of terminal portions and the second pair of terminal portions are formed of a single metal plate.

17. The LED package according to claim 11 , wherein the housing comprises a cavity for exposing portions of the first pair of terminal portions and the chip attaching portion to the upper side, a region in which the cavity is formed in the housing has the shortest interval between the first pair of terminal portions.

18. The LED package according to claim 11 , wherein the chip attaching portion has a substantially quadrangular shape.

19. The LED package according to claim 11 , wherein at least one of the terminal portions comprises a moisture shield arranged on a surface thereof, wherein the moisture shield comprises a wall protruding from the surface of the terminal portion and contacting the housing.

20. The LED package as claimed in claim 11 , wherein the housing comprises a cavity for exposing portions of the first pair of terminal portions, the second pair of terminal portions and the chip attaching portion to the upper side, a moisture shielding wall contacting an encapsulant and arranged in an inner wall of the cavity.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 25, 2024
From: SEOUL SEMICONDUCTOR CO., LTD.
To: FAIRLIGHT INNOVATIONS, LLC
Reel/Frame 069400/0867 →