SOLAR CELL AND METHOD FOR MANUFACTURING THE SOLAR CELL
An exemplary embodiment of the present invention provides a method for manufacturing a solar cell, which includes: forming a first semiconductor layer on a first surface of a light-absorbing layer, forming a second semiconductor layer on a second surface of the light-absorbing layer, forming a first transparent conductive layer having one X-ray diffraction peak on the first semiconductor layer in a first direction, forming a second transparent conductive layer having one X-ray diffraction peak on the second semiconductor layer in a second direction opposite to the first direction, forming a first electrode on the first transparent conductive layer in the first direction and forming a second electrode on the second transparent conductive layer in the second direction, in which at least one of the first transparent conductive layer and the second transparent conductive layer is formed at about 180 to about 220° C., at least one of the first transparent conductive layer and the second transparent conductive layer includes oxidized tungsten, and 2θ is 30.2±0.1 degrees in the X-ray diffraction peak.
1 . A method for manufacturing a solar cell, comprising:
forming a first semiconductor layer on a first surface of a light-absorbing layer;
forming a second semiconductor layer on a second surface of the light-absorbing layer;
forming a first transparent conductive layer having one X-ray diffraction peak on the first semiconductor layer in a first direction;
forming a second transparent conductive layer having one X-ray diffraction peak on the second semiconductor layer in a second direction opposite to the first direction;
forming a first electrode on the first transparent conductive layer in the first direction; and
forming a second electrode on the second transparent conductive layer in the second direction,
wherein at least one of the first transparent conductive layer and the second transparent conductive layer is formed at about 180 to about 220° C.,
at least one of the first transparent conductive layer and the second transparent conductive layer includes oxidized tungsten, and
2θ is 30.2±0.1 degrees in the X-ray diffraction peak.
2 . The method of claim 1 , wherein the forming of the first transparent conductive layer or the second transparent conductive layer further includes injecting argon gas and oxygen gas,
wherein the pressure ratio of the argon gas and the oxygen gas is in a range of about 8:1 to about 11:1.
3 . The method of claim 2 , wherein at least one of the first transparent conductive layer and the second transparent conductive layer further includes oxidized indium.
4 . The method of claim 3 , wherein a weight ratio of the oxidized indium and the oxidized tungsten in at least one of the first transparent conductive layer and the second transparent conductive layer is about 99:1.
5 . The method of claim 3 , wherein at least one of the first transparent conductive layer and the second transparent conductive layer further includes at least one of tin (Sn), molybdenum (Mo), titanium (Ti), zirconium (Zr), zinc (Zn), gadolinium (Gd), niobium (Nb), neodymium (Nd) and tantalum (Ta).
6 . The method of claim 1 , wherein the first transparent conductive layer and the second transparent conductive layer are simultaneously formed.
7 . The method of claim 1 , wherein sheet resistance of at least one of the first transparent conductive layer and the second transparent conductive layer is in a range of about 26.1 to about 26.4Ω.
8 . The method for manufacturing a solar cell of claim 1 , wherein the light-absorbing layer is made of crystalline silicon.
9 . The method of claim 1 , wherein the first semiconductor layer is formed by doping amorphous silicon with P-type impurities.
10 . The method of claim 1 , wherein the second semiconductor layer is formed by doping amorphous silicon with N-type impurities.
11 . A solar cell comprising:
a first semiconductor layer disposed on a first surface of a light-absorbing layer;
a second semiconductor layer disposed on a second surface of the light-absorbing layer;
a first transparent conductive layer disposed on the first semiconductor layer in a first direction;
a second transparent conductive layer disposed on the second semiconductor layer in a second direction opposite to the first direction;
a first electrode disposed on the first transparent conductive layer in the first direction; and
a second electrode disposed on the second transparent conductive layer in the second direction,
wherein at least one of the first transparent conductive layer and the second transparent conductive layer includes oxidized tungsten, and
at least one of the first transparent conductive layer and the second transparent conductive layer has one X-ray diffraction peak, and 2θ is 30.2±0.1 degrees in the X-ray diffraction peak.
12 . The solar cell of claim 11 , wherein at least one of the first transparent conductive layer and the second transparent conductive layer further includes oxidized indium
13 . The solar cell of claim 12 , wherein a weight ratio of the oxidized indium and the oxidized tungsten in at least one of the first transparent conductive layer and the second transparent conductive layer is about 99:1.
14 . The solar cell of claim 12 , wherein at least one of the first transparent conductive layer and the second transparent conductive layer further includes at least one of tin (Sn), molybdenum (Mo), titanium (Ti), zirconium (Zr), zinc (Zn), gadolinium (Gd), niobium (Nb), neodymium (Nd) and tantalum (Ta).
15 . The solar cell of claim 11 , wherein sheet resistance of at least one of the first transparent conductive layer and the second transparent conductive layer is in a range of about 26.1 to about 26.4Ω.
16 . The solar cell of claim 11 , wherein the light-absorbing layer is made of crystalline silicon.
17 . The solar cell of claim 11 , wherein the first semiconductor layer includes amorphous silicon doped with P-type impurities.
18 . The solar cell of claim 11 , wherein the second semiconductor layer includes amorphous silicon doped with N-type impurities.
19 . The method of claim 1 , further comprising before forming the first semiconductor layer and the second semiconductor layer, forming a first buffer layer made of amorphous silicon on the first surface of the light -absorbing layer and a second buffer layer made of amorphous silicon on the second surface of the light-absorbing layer.
20 . A solar cell comprising:
a first buffer layer formed of amorphous silicon and disposed on a first surface of a light-absorbing layer, wherein the light-absorbing layer is made of crystalline silicon;
a second buffer layer formed of amorphous silicon and disposed on a second surface of the light-absorbing layer;
a first semiconductor layer formed of amorphous silicon doped with P-type impurities and disposed on the first buffer layer in a first direction;
a second semiconductor layer formed of amorphous silicon doped with N-type impurities and disposed on the second buffer layer in a second direction opposite to the first direction;
a first transparent conductive layer disposed on the first semiconductor layer in the first direction ;
a second transparent conductive layer disposed on the second semiconductor layer in the second direction;
a first electrode formed of a low resistance metal and disposed on the first transparent conductive layer in the first direction; and
a second electrode formed of a low resistance metal and disposed on the second transparent conductive layer in the second direction,
wherein each of the first transparent conductive layer and the second transparent conductive layer includes oxidized tungsten and oxidized indium in a weight ratio of the oxidized indium and the ozidized tungsten of about 99:1, and
wherein each of the first transparent conductive layer and the second transparent conductive layer has one X-ray diffraction peak, and 2θ is 30.2±0.1 degrees in the X-ray diffraction peaks of the first transparent conductive layer and the second transparent conductive layer.