Process for producing substrate provided with metal pattern and substrate provided with metal laminate
View Patent ↗The present invention relates to a process for producing a substrate provided with a metal pattern by forming a pattern of a metal layer on a substrate using a laser light, the process including: a step of preparing a substrate in which the metal layer is formed on a surface thereof; a step of forming on the metal layer an assist layer which comprises a metal material different from that of the metal layer and which has a light absorptivity for the laser light different from that of the metal layer, thereby forming a metal laminate on the substrate; and a step of patterning the metal layer by irradiating the metal laminate with the laser light to remove a laser light-irradiated portion of the metal laminate, thereby forming a metal pattern on the substrate.
1. A process for producing a substrate provided with a metal pattern, comprising:
preparing a substrate on which a metal layer having a thickness of 200 nm or greater is formed;
forming on the metal layer an assist layer such that a metal laminate comprising the metal layer and the assist layer is formed on the substrate; and
irradiating a laser light on the metal laminate in a pattern such that a laser light-irradiated portion of the metal laminate is removed in the pattern, the metal layer is patterned and a metal pattern comprising a remaining portion of the metal layer is formed on the substrate,
wherein the assist layer comprises a metal material different from a metal material of the metal layer and has a light absorptivity for the laser light different from a light absorptivity of the metal layer.
2. The process for producing a substrate according to claim 1 , wherein the assist layer has a higher light absorptivity for the laser light than the light absorptivity of the metal layer.
3. The process for producing a substrate according to claim 1 , wherein the assist layer is formed with a thickness smaller than a thickness of the metal layer.
4. The process for producing a substrate according to claim 3 , wherein the metal material of the metal layer has 80 atom % or more of copper, aluminum or molybdenum.
5. The process for producing a substrate according to claim 1 , wherein the assist layer includes at least one element selected from the group consisting of chromium, cobalt, zirconium, tin, titanium, iron, molybdenum and nickel.
6. The process for producing a substrate according to claim 1 , wherein the laser light has a wavelength in a range of from 320 to 1070 nm.
7. The process for producing a substrate according to claim 1 , wherein the laser light has an energy density in a range of from 0.3 to 10 J/cm 2 .
8. The process for producing a substrate according to claim 1 , wherein the thickness of the metal layer is 10 μm or less.
9. The process for producing a substrate according to claim 1 , wherein the assist layer has a thickness in a range of from 5 to 200 nm.
10. The process for producing a substrate according to claim 1 , wherein the substrate is a glass substrate.
11. The process for producing a substrate according to claim 1 , wherein the substrate has a low-reflective layer which reduces reflection of light toward the substrate and which is formed between the substrate and the metal layer.
12. The process for producing a substrate according to claim 1 , wherein the assist layer forms a protective layer for the metal layer.
13. The process for producing a substrate according to claim 1 , further comprising removing the assist layer after the metal pattern is formed.
14. The process for producing a substrate according to claim 1 , further comprising forming a low-reflective layer which reduces reflection of light toward the substrate such that the low-reflective layer comprising a metal oxide film is formed between the substrate and the metal layer.
15. The process for producing a substrate according to claim 1 , further comprising forming a low-reflective layer which reduces reflection of light toward the substrate such that the low-reflective layer comprising a metal oxide film is formed between the substrate and the metal layer, wherein the metal oxide film of the low-reflective layer includes a metal oxide of Mo or Cr.