Cooling apparatus for optically pumped semiconductor laser
View Patent ↗An OPS-chip is soldered mirror-structure-side down on an upper surface of diamond-heat spreader. A metal frame is also soldered to the upper surface of the heat-spreader. The lower surface of the diamond heat-spreader is either soldered to, or clamped against, a surface of a heat-sink. The dimensions of the frame and the heat spreader are selected such that at a solidification temperature of the solder at the center of the upper surface of the heat-spreader has an effective CTE comparable with that of the OPS-chip. The lower surface of the heat-spreader can be soldered to the heat sink surface or clamped against the heat-sink surface by the frame.
1. Apparatus, comprising:
a copper heat-sink having a heat-sink surface;
a diamond heat-spreader having first and second opposite surfaces and side walls;
an optically pumped semiconductor chip (OPS-chip) having a multilayer semiconductor gain-structure surmounting a mirror structure, the minor structure of the OPS-chip being soldered by a hard solder to the second surface of the heat-spreader and with the first surface of the diamond heat-spreader being soldered to the heat sink surface; and
a steel frame having a top and a base, a recess in the base having dimensions greater than the dimensions of the diamond heat-spreader, said recess having a peripheral shelf and side walls, said steel frame including an aligned aperture having dimensions smaller than the dimensions of the diamond heat spreader, the diamond heat-spreader being soldered by the hard solder into the recess in the frame with the OPS-chip thereon in the aperture of the steel frame, with the second surface of the heat-spreader being bonded to the peripheral shelf and with the side walls of the heat-spreader being bonded to the side walls of the recess and the base of the steel frame being soldered to the heat sink surface, wherein the bonding of the steel frame to the diamond heat-spreader functions to increase the effective coefficient of thermal expansion (CTE) of the diamond heat-spreader.
2. The apparatus of claim 1 , wherein the dimensions of the steel frame and the dimensions of the diamond heat-spreader are selected such that, at a solidification temperature of the hard solder, the diamond heat-spreader, at the center of the second surface thereof, has an effective coefficient of expansion (CTE) about the same as that of the OPS-chip.
3. The apparatus of claim 2 , wherein the OPS-chip is a GaAs based OPS-chip having a CTE of about 6 ppm/K.
4. The apparatus of claim 1 , wherein the diamond heat-spreader has a thickness greater than about 0.3 mm.
5. An apparatus comprising:
a copper heat sink with a planar surface;
an optically pumped semiconductor (OPS-chip);
a diamond heat spreader having first and second opposite surfaces and side walls, said heat spreader being interposed between and bonded to both the heat sink and the OPS chip, said diamond heat spreader having a thickness greater than 0.3 mm; and
a steel frame having a planar surface bonded to the planar surface of the heat sink, said steel frame having a central opening aligned with the OPS chip, said central opening having a peripheral shelf soldered to the surface of the heat spreader opposite to the heat sink, said opening having side walls soldered to the side walls of the heat spreader and wherein the bonding of the steel frame to the diamond heat spreader functions to increase the effective coefficient of thermal expansion (CTE) of the diamond heat spreader.
6. An apparatus as recited in claim 5 wherein the side walls of the central opening of the frame are outwardly tapered in a direction away from the OPS chip.
7. An apparatus comprising:
a copper heat sink with a planar surface;
an optically pumped semiconductor chip (OPS-chip);
a diamond heat spreader interposed between the heat sink and the OPS chip with the upper surface of the head spreader being bonded to the OPS chip and the lower surface of the heat spreader being in thermal communication with the planar surface of the heat sink, said heat spreader having side walls; and
a steel frame having a planar surface soldered to the planar surface of the heat sink, said steel frame having a central opening with dimensions larger than the dimensions of the OPS-chip, said central opening being aligned with the OPS chip, said central opening having a downwardly facing peripheral shelf soldered to the upper surface of the heat spreader in the region surrounding the OPS chip, said central opening having side walls soldered to the side walls of the heat spreader and wherein the bonding of the steel frame to the diamond heat spreader functions to increase the effective coefficient of thermal expansion (CTE) of the diamond heat spreader.
8. The apparatus of claim 7 , wherein the lower surface of the heat spreader is soldered to the heat-sink surface.
9. The apparatus of claim 7 , wherein the heat-sink surface has a pyrolitic carbon insert therein, and the heat-spreader is clamped in thermal communication with the pyrolitic carbon insert.
10. The apparatus of claim 7 wherein the heat spreader has a thickness greater than 0.3 mm.