Methods of manufacturing wire, multi-layer wire pre-products and wires
View Patent ↗Exemplary methods for manufacturing a wire and resultant wires are disclosed herein. The method includes extruding a receptor cross-linkable polymer that is substantially free of curing agent about a conductive core and extruding a donor polymer in association with a curing agent. The method includes disposing the donor polymer about the receptor polymer and conductive core to create a multi-layer wire pre-product. The method also includes heat curing a multi-layer wire pre-product to form a wire.
1. An article of manufacture, comprising:
a conductive core;
an extruded cross-linkable receptor polymer substantially free of curing agent, the receptor polymer being disposed about the conductive core;
an extruded donor polymer comprising a curing agent, the donor polymer being disposed about the receptor polymer and in contact with the receptor polymer, wherein the thickness of the donor polymer to the thickness of the receptor polymer is about 1:1 to about 1:5; and
an insulative layer between the receptor polymer and the conductive core,
wherein the receptor and donor polymers are not cured.
2. The article of claim 1 , wherein the conductive core comprises a semi-conductive material.
3. The article of claim 1 , wherein the conductive core comprises at least one of solid copper, stranded copper, nickel silver, beryllium, phosphor bronze, nickel, copper-clad aluminum, copper-clad steel, aluminum and steel.
4. The article of claim 1 , wherein the donor polymer has a melt temperature lower than a melt temperature of the receptor polymer.
5. The article of claim 4 , wherein the donor polymer has a melt temperature lower than a melt temperature of the receptor polymer by at least about 5° C.
6. An article of manufacture, comprising:
a conductive core;
an extruded cross-linkable receptor polymer substantially free of curing agent, the receptor
polymer being disposed about the conductive core; and
an extruded donor polymer comprising a curing agent, the donor polymer being disposed about the receptor polymer and in contact with the receptor polymer, wherein the thickness of the donor polymer to the thickness of the receptor polymer is about 1:1 to about 1:5,
wherein the receptor and donor polymers are not cured, and
wherein the donor polymer has a melt temperature lower than a melt temperature of the receptor polymer.
7. The article of claim 6 , wherein the conductive core comprises a semi-conductive material.
8. The article of claim 6 , wherein the conductive core comprises at least one of solid copper, stranded copper, nickel silver, beryllium, phosphor bronze, nickel, copper-clad aluminum, copper-clad steel, aluminum and steel.
9. The article of claim 6 , wherein the donor polymer has a melt temperature lower than a melt temperature of the receptor polymer by at least about 5° C.