Laser processing method and laser processing apparatus

1. A laser processing method of a sapphire substrate in a light emitting diode (LED) element comprising:

preparing a sapphire substrate on which plural stacked portions spaced from each other are formed;

irradiating a short pulse laser beam from a laser light source;

making the laser beam irradiated from the laser light source pass through a beam shaping module;

adjusting a position of a light concentrating unit or the sapphire substrate such that the laser beam is concentrated to the inside of the sapphire substrate of the LED element through the light concentrating unit and a phase transformation area is formed within the sapphire substrate; and

detecting photoluminescence light emitted by the stacked portions due to the laser beam,

wherein the photoluminescence light is incident to a detection unit through a dichroic mirror provided between the laser light source and the light concentrating unit, and when the detection unit detects the photoluminescence light, the laser beam is controlled so as to be introduced into the sapphire substrate while avoiding an area where the stacked portions are formed on the sapphire substrate.

2. The laser processing method of claim 1 , wherein the phase transformation area formed within the sapphire substrate does not reach a front surface or a rear surface of the sapphire substrate.

3. The laser processing method of claim 1 , wherein the laser beam is penetrative to the sapphire substrate or the stacked portions.

4. The laser processing method of claim 1 , wherein the stacked portions includes one or more of a n-GaN layer, a p-GaN layer, an InGaN layer, a p-electrode layer, and a n-electrode layer.

5. The laser processing method of claim 1 , wherein in the process of forming the phase transformation area within the sapphire substrate, the phase transformation area is formed by concentrating the laser beam to plural areas within the sapphire substrate in a thickness direction.

6. The laser processing method of claim 1 , wherein in the process of forming the phase transformation area within the sapphire substrate, plural first phase transformation areas and second transformation areas crossed with each other as viewed from a plane of the sapphire substrate are formed.

7. The laser processing method of claim 1 , further comprising: cutting the sapphire substrate with the phase transformation area as a starting point.

8. The laser processing method of claim 7 , wherein in the process of cutting the sapphire substrate, the sapphire substrate is cut by applying an external force to the phase transformation area and generating cracks from the phase transformation area in a direction toward a front surface or a rear surface of the sapphire substrate.

9. The laser processing method of claim 7 , wherein the process of cutting the sapphire substrate includes attaching an extension film to an upper side or a lower side of the sapphire substrate and dividing the sapphire substrate by extending the extension film in a plane direction.

10. The laser processing method of claim 1 , wherein the laser light source, the beam shaping module, and the light concentrating unit are arranged linearly along a same axis.

11. The laser processing method of claim 10 , wherein the beam shaping module is provided below the laser light source.

12. The laser processing method of claim 11 , wherein the light concentrating unit is provided below the beam shaping module.

13. The laser processing method of claim 10 , wherein the dichroic mirror is provided between beam shaping module and the light concentrating unit.

14. The laser processing method of claim 1 , wherein the laser beam irradiated from the laser light source is directly transmitted to the beam shaping module.