Method for manufacturing composite piezoelectric substrate and piezoelectric device
A piezoelectric device is manufactured in which the material of a supporting substrate can be selected from various alternative materials. Ions are implanted into a piezoelectric substrate to form an ion-implanted portion. A temporary supporting substrate is formed on the ion-implanted surface of the piezoelectric substrate. The temporary supporting substrate includes a layer to be etched and a temporary substrate. The piezoelectric substrate is then heated to be divided at the ion-implanted portion to form a piezoelectric thin film. A supporting substrate is then formed on the piezoelectric thin film. The supporting substrate includes a dielectric film and a base substrate. The temporary supporting substrate is made of a material that produces a thermal stress at the interface between the temporary supporting substrate and the piezoelectric thin film less than the thermal stress at the interface between the supporting substrate and the piezoelectric thin film.
1. A piezoelectric device comprising:
a piezoelectric thin film formed by dividing a piezoelectric substrate at a portion having a peak concentration of an ionized element implanted in the piezoelectric substrate, the piezoelectric thin film including a divided surface at which the piezoelectric thin film was divided from the piezoelectric substrate and a surface opposite to the divided surface;
a supporting substrate disposed on a side of the divided surface of the piezoelectric thin film; and
a functional electrode disposed on a side of the surface of the piezoelectric thin film opposite to the divided surface.
2. The piezoelectric device according to claim 1 , wherein the functional electrode is an interdigital transducer electrode.
3. The piezoelectric device according to claim 1 , wherein a support layer region and a cavity are disposed between the supporting substrate and the piezoelectric thin film, the support layer region enabling the piezoelectric thin film to be supported by the supporting substrate, the cavity being provided by removing a sacrificial layer region.