IP Library Granted Patent US 8,729,168
Granted Patent B2
US 8,729,168 · App. 13/093,013 · Granted May 20, 2014

Vehicular glass adhesive and method of adhering said glass

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Quick Facts
Patent No.
US 8,729,168
App. No.
13/093,013
Granted
May 20, 2014
Kind
B2
Abstract

The invention is an adhesive composition comprising: a) an isocyanate functional polyether base prepolymers having a z molecular weight average (Mz) of about 10,000 to about 80,000 g/mole; a carbon black having an average oil absorption number of at least about 80 to at most about 400 cubic centimeters of dibutyl phthalate per 100 grams of the carbon black; (c) reactive silicon in an amount from about 0.001% to about 10% by weight of the adhesive composition; and (d) one or more catalysts for the reaction of isocyanate with hydroxyl groups. The adhesive compositions of the invention surprisingly may have improved sag performance (i.e., decreased sag) when heated, while also making them more easily pumped.

Claims (19)

1. An adhesive composition comprising: a) an isocyanate functional polyether base prepolymers having a z molecular weight average (Mz) of about 10,000 to about 80,000 g/mole; (b) a carbon black having an average oil absorption number of at least about 80 to at most about 400 cubic centimeters of dibutyl phthalate per 100 grams of the carbon black; (c) reactive silicon in an amount from about 0.001% to about 10% by weight of the adhesive composition; and (d) one or more catalysts for the reaction of isocyanate with hydroxyl groups.

2. The adhesive composition of claim 1 wherein the adhesive composition has a sag of less than 5 mm.

3. The adhesive composition of claim 2 wherein the adhesive composition has a sag of greater than 5 mm at ambient temperatures and a sag of less than 5 mm at temperatures greater than ambient.

4. The adhesive composition of claim 3 wherein the carbon black has an oil absorption of about 100 to about 150.

5. The adhesive composition of claim 4 wherein the adhesive composition has less than 5 mm of sag at ambient temperature and the z molecular weight average of the isocyanate functional polyether base prepolymer is at most 70,000 g/mole.

6. The adhesive composition of claim 5 further comprising a high polar plasticizer and low polar plasticizer, wherein the high polar plasticizer is one or more alkyl esters of sulfonic acid and the low polar plasticizer is one or more aromatic diesters.

7. The adhesive composition of claim 6 wherein the isocyanate functional polyether base prepolymers has a free isocyanate content from about 0.8% to about 4% by weight.

8. The adhesive composition of claim 1 wherein the composition further comprises one or more polyisocyanates having a nominal functionality of about 2 or greater.

9. The adhesive composition of claim 8 wherein the polyfunctional polyisocyanate is an oligomer or polymer based on hexamethylene diisocyanate or methylene diphenyl diisocyanate.

10. The adhesive composition of claim 1 , wherein the carbon black has an iodine number of at least 80 mg/g of carbon black.

11. The adhesive composition of claim 10 , wherein the product of the oil absorption and iodine number of the carbon black is at least 7,000.

12. The adhesive composition of claim 1 , wherein the adhesive composition is further comprised of a clay filler.

13. The adhesive composition of claim 1 , wherein the product of the oil absorption and iodine number of the carbon black is at least 9,000.

14. The adhesive composition of claim 1 , wherein the carbon black is present in the adhesive composition in an amount of at least about 18% by weight of the adhesive composition.

15. The adhesive composition of claim 2 , wherein the sag is greater at a temperature below ambient temperature that at temperatures higher than ambient and the sag at ambient temperatures is 0 mm to at most 1 mm.

16. The adhesive composition of claim 3 wherein the carbon black is present in an amount of about 20 parts by weight or more of the adhesive composition.

17. The adhesive composition of claim 3 wherein the carbon black is present in an amount of at least about 23 parts by weight of the adhesive composition.

18. The adhesive composition of claim 3 wherein the adhesive has a sag that is greater at a temperature below ambient temperature than at temperature above ambient temperatures.

19. The adhesive composition of claim 18 , wherein the adhesive composition has a sag of 0 to 1 mm at 23° C.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 069923/0030 →
CHANGE OF LEGAL ENTITY Recorded Sep 10, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068907/0881 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068922/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2014
From: JIALANELLA, GARY L.; CHRISTENSON, CHRISTOPHER P.; GINZBURG, VALERIY V.; RISTOSKI, TONI; COLE, ERIC E.; TOBIN, SEAN C.; ZHOU, LIRONG
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 032589/0173 →