IP Library Granted Patent US 8,843,062
Granted Patent B2
US 8,843,062 · App. 13/097,167 · Granted Sep 23, 2014

Coupling area enhancement apparatus, system, and method

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Quick Facts
Patent No.
US 8,843,062
App. No.
13/097,167
Granted
Sep 23, 2014
Kind
B2
Abstract

A coupling area enhancement device includes a small coil and a large coil on opposing sides of a sheet of electromagnetic interference (EMI) absorptive material. The coupling area enhancement device may include one or more holes and may include adhesive material and sticker covers. Placement of the coupling area enhancement device may be accomplished by sticking the small coil to a host device near a contactless antenna. The large coil may also be stuck to a battery cover.

Claims (31)

1. A coupling area enhancement device comprising:

a sheet of electromagnetic interference (EMI) absorptive material;

a first coil on a first side of the sheet of EMI absorptive material; and

a second coil on a second side of the sheet of EMI absorptive material, wherein the second coil is coupled to the first coil, and the second coil is larger than the first coil.

2. The coupling area enhancement device of claim 1 wherein the first coil is electrically coupled to the second coil.

3. The coupling area enhancement device of claim 1 wherein the first coil is magnetically coupled to the second coil.

4. The coupling area enhancement device of claim 1 wherein the sheet of EMI absorptive material includes at least one hole.

5. The coupling area enhancement device of claim 1 wherein the first coil is located at one corner of the sheet of EMI absorptive material.

6. The coupling area enhancement device of claim 1 wherein the first coil is located at one edge of the sheet of EMI absorptive material.

7. The coupling area enhancement device of claim 1 further comprising a plurality of small coils on the first side.

8. The coupling area enhancement device of claim 1 further comprising adhesive material on the first side of the sheet of EMI absorptive material.

9. The coupling area enhancement device of claim 8 wherein the adhesive material is placed to adhere a portion of the coupling area enhancement device corresponding to the first coil to a coupling area of a separate device.

10. The coupling area enhancement device of claim 9 further comprising additional adhesive material on the second side of the sheet of EMI absorptive material, wherein an area of the additional adhesive material on the second side is larger than an area of the adhesive material on the first side.

11. A coupling area enhancement device comprising:

a flexible substrate with electromagnetic interference (EMI) absorptive qualities;

a first coil on a first side of the flexible substrate; and

a second coil on the first side of the flexible substrate, wherein the second coil is electrically coupled to the first coil, and the second coil is larger than the first coil.

12. The coupling area enhancement device of claim 11 wherein the first and second coils are located apart from each other such that when folded the flexible substrate creates a structure with the first and second coils on opposing sides.

13. The coupling area enhancement device of claim 12 further comprising adhesive material formed over the first coil to aid in locating the first coil over a coupling area of a mobile device.

14. The coupling area enhancement device of claim 13 further comprising additional adhesive material formed over the second coil to aid in securing the coupling area enhancement device.

15. The coupling area enhancement device of claim 11 wherein the flexible substrate has EMI absorptive qualities at substantially 13.56 MHz.

16. An apparatus comprising:

a contactless device with a loop antenna; and

a coupling area enhancement device having a first coil placed to couple to the loop antenna, a second coil larger than the first coil and coupled to the first coil, and a sheet of electromagnetic interference (EMI) absorptive material between the first and second coils.

17. The apparatus of claim 16 wherein the first coil is electrically coupled to the second coil.

18. The apparatus of claim 16 wherein the first coil is magnetically coupled to the second coil.

19. The apparatus of claim 16 further comprising a memory card, wherein the loop antenna is on the memory card.

20. The apparatus of claim 16 wherein the apparatus comprises a mobile phone.

21. The apparatus of claim 16 wherein the sheet of EMI absorptive material includes at least one hole.

22. The apparatus of claim 21 wherein the at least one hole is aligned to accommodate a mobile phone accessory device.

23. The apparatus of claim 22 wherein the at least one hole is aligned to accommodate one of: a speaker, a camera, or a microphone.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Aug 4, 2020
From: RPX CORPORATION
To: TYFONE, INC.
Reel/Frame 053396/0443 →
SECURITY INTEREST Recorded May 15, 2015
From: TYFONE, INC.
To: RPX CORPORATION
Reel/Frame 035685/0760 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2011
From: NARENDRA, SIVA G.; CHAKRABORTY, SAURAV
To: TYFONE, INC.
Reel/Frame 026371/0069 →