IP Library Granted Patent US 8,542,537
Granted Patent B2
US 8,542,537 · App. 13/098,378 · Granted Sep 24, 2013

Method and apparatus for temperature compensation for programming and erase distributions in a flash memory

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Quick Facts
Patent No.
US 8,542,537
App. No.
13/098,378
Granted
Sep 24, 2013
Kind
B2
Abstract

A method and apparatus for a memory device is provided. The memory device includes a memory cell, a memory controller, and a temperature-sensing device that detects a temperature. The memory controller enables adjusting, based on the detected temperature, a parameter associated with a bit-altering operation to the memory cell that changes a threshold voltage of the memory cell such that the threshold voltage to which the memory cell is changed to by the bit-altering operation is compensated for variations in temperature.

Claims (30)

1. A memory device, comprising:

a temperature-sensing device that is arranged to detect a temperature;

a memory cell; and

a memory controller that is configured to enable adjusting, based on the detected temperature, a parameter associated with a bit-altering operation of the memory cell that changes a threshold voltage of the memory cell such that the threshold voltage to which the memory cell is changed to by the bit-altering operation is substantially compensated for variations in temperature.

2. The memory device of claim 1 , wherein the bit-altering operation includes at least one of a program operation or an erase operation.

3. The memory device of claim 1 , wherein the parameter associated with the bit-altering operation is a pulse duration for which a voltage is applied to the memory cell.

4. The memory device of claim 1 , wherein the memory controller is configured to adjust the parameter based on a stored scaling factor correlating changes in temperature to changes in the parameter.

5. The memory device of claim 1 , wherein the temperature-sensing device includes means for temperature sensing; or the memory cell includes means for storing information; or the memory controller includes means for enabling adjusting, based on the detected temperature, the parameter associated with the bit-altering operation of a memory cell of the plurality of memory cells that changes the threshold voltage of the memory cell such that the threshold voltage to which the memory cell is changed to by the bit-altering operation is substantially compensated for variations in temperature.

6. A machine-readable storage medium that includes an electronic design file that is configured to control a fabrication of the memory device of claim 1 .

7. A method, comprising transmitting, over a network, an article of manufacture including a machine-readable medium that includes an electronic design file that is configured to control a fabrication of the memory device of claim 1 .

8. The memory device of claim 1 , wherein the temperature-sensing device is a temperature-sensing diode.

9. The memory device of claim 8 , wherein the memory controller is configured to convert a voltage across the temperature-sensing diode into the detected temperature.

10. The memory device of claim 1 , wherein the memory cell has a drain, and wherein the parameter associated with the bit-altering operation is a bit line voltage that is provided to the drain of the memory cell during the bit-altering operation.

11. The memory device of claim 10 , farther comprising:

a charge pump that is arranged to provide a first boosted voltage; and

a voltage regulator that is arranged to receive the first boosted voltage, and to provide the bit line voltage, wherein the voltage regulator is arranged to regulate the bit line voltage to a voltage level that is based on control from the memory controller.

12. The memory device of claim 1 , wherein the memory cell has a control gate, and wherein the parameter associated with the bit-altering operation is a word line voltage that is provided to the control gate of the memory cell during the bit-altering operation.

13. The memory device of claim 12 , further comprising:

a charge pump that is arranged to provide a first boosted voltage; and

a voltage regulator that is arranged to receive the first boosted voltage, and to provide the word line voltage, wherein the voltage regulator is arranged to regulate the word line voltage to a voltage level that is based on control from the memory controller.

14. A method, comprising:

detecting a temperature; and

adjusting, based on the detected temperature, a parameter associated with a bit-altering operation of a memory cell that changes a threshold voltage of the memory cell such that the threshold voltage to which the memory cell is changed to by the bit-altering operation is substantially compensated for variations in temperature.

15. The method of claim 14 , wherein the bit-altering operation includes at least one of a program operation or an erase operation.

16. The method of claim 14 , wherein the memory cell has a drain, and wherein the parameter associated with the bit-altering operation is a bit line voltage that is provided to the drain of the memory cell during the bit-altering operation.

17. The method of claim 14 , wherein the memory cell has a control gate, and wherein the parameter associated with the bit-altering operation is a word line voltage that is provided to the control gate of the memory cell during the bit-altering operation.

18. The method of claim 14 , wherein the parameter associated with the bit-altering operation is a pulse duration for which a voltage is applied to the memory cell.

19. The method of claim 14 , wherein the memory controller is configured to adjust the parameter based on a stored scaling factor correlating changes in temperature to changes in the parameter.

20. The method of claim 14 , wherein detecting the temperature includes:

converting a voltage across a temperature-sensing diode into the detected temperature.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2022
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES LLC
Reel/Frame 059721/0467 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036052/0016 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2011
From: PARKER, ALLAN
To: SPANSION LLC
Reel/Frame 026204/0918 →