Mechanical sintering of nanoparticle inks and powders
Nanoparticle inks and powders are sintered using an applied mechanical energy, such as uniaxial pressure, hydrostatic pressure, and ultrasonic energy, which may also include applying a sheer force to the inks or powders in order to make the resultant film or line conductive.
1. A method for making a material conductive comprising:
depositing a film of nanoparticles on a substrate; and
performing a mechanical sintering process at room temperature on the film in a manner that applies shearing forces to the film resulting in the film of nanoparticles possessing a property of conductivity greater than before the mechanical sintering process is performed.
2. The method as recited in claim 1 , wherein the film of nanoparticles comprises metallic nanoparticles.
3. The method as recited in claim 2 , wherein the metallic nanoparticles are copper nanoparticles.
4. The method as recited in claim 1 , wherein the mechanical sintering process comprises applying an ultrasonic bonding tip to the film of nanoparticles.
5. The method as recited in claim 4 , further comprising physically pressing the ultrasonic bonding tip against the film of nanoparticles.
6. The method as recited in claim 1 , wherein the mechanical sintering process comprises physically pressing against the film of nanoparticles between rollers.
7. The method as recited in claim 1 , wherein the film of nanoparticles is deposited on the substrate with an ink-jetting process.
8. The method as recited in claim 1 , wherein the mechanical sintering process comprises applying a uniaxial pressure against the film of nanoparticles.
9. The method as recited in claim 1 , wherein the mechanical sintering process comprises applying a hydrostatic pressure against the film of nanoparticles.
10. The method as recited in claim 1 , wherein the mechanical sintering process causes the nanoparticles to experience grain boundary sliding between each other.
11. The method as recited in claim 1 , wherein the film of nanoparticles is deposited on the substrate with a powder deposition process.
12. The method as recited in claim 1 , wherein the substrate is a polyimide substrate.
13. The method as recited in claim 1 , further comprising photosintering the film of nanoparticles subsequent to the performing of the mechanical sintering process.
14. The method as recited in claim 5 , wherein the physical pressing of the ultrasonic bonding tip against the film of nanoparticles is applied with a force up to and including 30 grams.
15. The method as recited in claim 5 , wherein the physical pressing of the ultrasonic bonding tip against the film of nanoparticles is performed with a pressure up to and including 30 MPa.
16. The method as recited in claim 13 , wherein the photosintering of the film of nanoparticles results in a photoreduction of copper oxides within the film into metal copper.
17. A method for making a material conductive comprising:
depositing a film of nanoparticles on a substrate; and
performing a mechanical sintering process at room temperature on the film in a manner that applies shearing forces to the film resulting in the film of nanoparticles possessing a property of conductivity greater than before the mechanical sintering process is performed, wherein the mechanical sintering process comprises physically pressing a spatula against the film of nanoparticles.
18. The method as recited in claim 17 , wherein the mechanical sintering process is performed on the film without externally applied heat.
19. A method for making a material conductive comprising:
depositing a film of nanoparticles on a substrate; and
performing a mechanical sintering process on the film in a manner that applies shearing forces to the film resulting in the film of nanoparticles possessing a property of conductivity greater than before the mechanical sintering process is performed, wherein the mechanical sintering process is performed on the film without application of heat from an external source.
20. The method as recited in claim 19 , wherein the mechanical sintering process is performed on the film at a temperature less than 50° C.
21. The method as recited in claim 19 , wherein the mechanical sintering process is performed on a film at substantially room temperature.