Semiconductor device with low on resistance
View Patent ↗A semiconductor device having a low on resistance and high integration level with respect to the surface area of a substrate is provided. In the semiconductor device, a first trench, a second trench, and a third trench are provided in an element formation region provided on a semiconductor substrate. Metal is deposited within the first trench and second trench, to form a drain electrode and a source electrode, respectively. Polysilicon is deposited inside the third trench with a gate insulating film intervening, and a gate electrode is formed.
1. A semiconductor device, comprising:
a first trench, provided in a semiconductor region of a first conduction type;
a drain electrode, formed within the first trench;
a second trench, provided in the semiconductor region of the first conduction type;
a source electrode, formed within the second trench;
a third trench narrower than the first trench and second trench, provided in the semiconductor region of the first conduction type, and in contact with a drift region associated with the first trench and a source region associated with the second trench; and
a gate electrode, formed within the third trench;
wherein the third trench is in contact with the drift region along a first wall of the third trench from a top edge of the drift region to a bottom edge of the third trench, and is in contact with the source region from a top edge of the source region to the bottom edge of the third trench;
wherein in a plan view a plurality of third trenches are arranged perpendicularly to both the first trench and the second trench, each of the plurality of third trenches having at least a third wall that begins at a point where a corresponding first wall is in contact with the drift region and ends at a point where a corresponding second wall is in contact with the source region, and
wherein at least one third trench of the plurality of third trenches is separated from another third trench of the plurality of third trenches by an area of an element formation region, the area of the element formation region being bounded by a third wall of the at least one third trench, a third wall of the other third trench, the drift region and the source region, and the area of the element formation region including a pickup region.
2. The semiconductor device according to claim 1 , wherein the second trench is parallel with the first trench.
3. The semiconductor device according to claim 1 , wherein the source region is of a second conduction type, and formed on a periphery of the second trench.
4. The semiconductor device according to claim 1 , wherein the gate electrode is formed of polysilicon, and the drain electrode and the source electrode are formed from metal.
5. The semiconductor device according to claim 1 , further comprising a drain region of a second conduction type, formed on a periphery of the first trench.
6. The semiconductor device according to claim 5 , wherein the drift region is of the second conduction type, is formed on the periphery of the drain region, and has an impurity concentration lower than that of the drain region.
7. The semiconductor device according to claim 1 , wherein the pickup region is of the first conduction type, provided on a surface of the semiconductor region of the first conduction type, and removed from the drift region and the source region.
8. The semiconductor region according to claim 7 , wherein a plurality of the gate electrodes and a plurality of the pickup regions are provided alternately.
9. The semiconductor device according to claim 7 , wherein the pickup region is formed parallel to at least one third trench on a surface of the element formation region.