Method for fixing a photovoltaic cell connector on a surface of a photovoltaic cell, photovoltaic cell connector forming die, device for fixing a photovoltaic cell connector on a surface of a photovoltaic cell

1. A method for patterning the surface of a solder-covered photovoltaic cell connector on the light-incidence side of a photovoltaic cell, the method comprising:

heating at least a part of the solder-covered photovoltaic cell connector which is in contact with the surface of the photovoltaic cell;

bonding the photovoltaic cell connector to contact areas of the photovoltaic cell;

patterning at least a part of the surface of the heated part of the solder-covered photovoltaic cell connector during said bonding so that a predetermined surface pattern is formed; and

cooling the photovoltaic cell connector by means of which the pattern is fixed on the solder-covered surface of the photovoltaic cell connector,

wherein the pattern is a trench pattern,

wherein the surface of the cell connector is patterned in such a manner that incident light is reflected from the surface of the photovoltaic cell connector especially in such a manner that this leads to a total reflection at the glass/air interface of a photovoltaic module.

2. The method as claimed in claim 1 , wherein the patterning takes place by means of a forming die which is impressed into the at least one part of the solder-covered surface of the photovoltaic cell connector.

3. The method as claimed in claim 2 , wherein the forming die is impressed into the at least one part of the photovoltaic cell connector whilst the at least one part of the photovoltaic cell connector cools off.

4. The method as claimed in claim 1 , wherein the electrical bonding takes place by means of a soldering process.

5. The method as claimed in claim 1 , wherein the patterning takes place by means of pressing a forming die into the surface of the heated part of the photovoltaic cell connector.

6. The method as claimed in claim 1 , wherein the layer thickness of the solder material forming a solder layer is at least so great that the forming pattern of the forming die is completely accommodated by the solder layer.

7. The method as claimed in claim 1 , wherein the predetermined surface patterns are greater than the wavelength of the light converted into electric current by the photovoltaic cell.