Composition for stripping and stripping method
View Patent ↗The present invention provides a stripping composition and a stripping method capable of easily stripping a color resist or an organic insulating film formed on a substrate to reuse the substrate when defects are found during a process of forming the color filter or organic insulating film on the substrate. In one embodiment, the stripping composition includes about 0.5 to about 45 wt % of hydroxide compound, about 10 to about 89 wt % of alkyleneglycolalkylether compound, about 5 to about 45 wt % of alkanolamine compound, and about 0.01 to about 5 wt % of inorganic salt compound. Advantageously, the stripping process can be performed without damaging a thin film transistor of a bottom substrate while removing the color resist or organic insulating film.
1. A stripping method, the method comprising:
forming a film containing organic materials on a substrate; and
stripping the film on the substrate using a stripping composition including about 0.5 to about 45 wt % of a hydroxide compound, about 10 to about 89 wt % of an alkyleneglycolalkylether compound, about 5 to about 45 wt % of an alkanolamine compound, and about 0.01 to about 5 wt % of an inorganic salt compound.
2. The stripping method of claim 1 , further comprising: inspecting the film for defects; and determining the film to be defective when a defect is detected, before stripping the film.
3. The stripping method of claim 1 , wherein the film is a color filter.
4. The stripping method of claim 1 , wherein the film is an organic insulating film.
5. The stripping method of claim 4 , wherein the organic insulating film is a negative type.
6. The stripping method of claim 1 , wherein the substrate comprises device laminates and the film is formed on the device laminates.
7. The stripping method of claim 6 , wherein the device laminates comprise a thin film transistor.
8. The stripping method of claim 7 , wherein the thin film transistor comprises an electrode formed of a metal including Al.