IP Library Patent Application 13102210
Patent Application
App. No. 13/102,210

Joule Heat Encapsulating Apparatus and Encapsulating Method Using the Same

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Quick Facts
Patent No.
US None
App. No.
13/102,210
Abstract

In a Joule heat encapsulating apparatus and an encapsulating method using the same, a panel is mounted on a stage, the panel including a thermal-hardening type sealant for surrounding and sealing a display unit formed between a first substrate and a second substrate, a heat-generating wiring overlapping the thermal-hardening type sealant, and an electric current application wiring connected to the heat-generating wiring. A cap is employed to form a sealed space, in which the panel is arranged, between the stage and the cap. An exhaustion mechanism for exhausting air in the sealed space, and a power applying mechanism connected to the electric current application wiring for supplying a current to the heat-generating wiring, are provided. As a result, a stable encapsulating structure which prevents permeation of oxygen or moisture may be easily formed.

Claims (21)

1 . A Joule heat encapsulating apparatus, comprising:

a stage on which a panel is mounted, the panel including a thermal-hardening type sealant for surrounding and sealing a display unit formed between a first substrate and a second substrate, a heat-generating wiring overlapping the thermal-hardening type sealant, and an electric current application wiring connected to the heat-generating wiring;

a cap for forming a sealed space, in which the panel is arranged, between the stage and the cap;

an exhaustion mechanism for exhausting air in the sealed space; and

a power applying mechanism connected to the electric current application wiring and supplying current to the heat-generating wiring.

2 . The Joule heat encapsulating apparatus of claim 1 , further comprising a sealing member which is elastically pressed between the stage and the cap, and which maintains the sealed space airtight.

3 . The Joule heat encapsulating apparatus of claim 2 , wherein the sealing member comprises one of a silicon O-ring and a cellular rubber O-ring.

4 . The Joule heat encapsulating apparatus of claim 1 , wherein the thermal-hardening type sealant comprises frit.

5 . The Joule heat encapsulating apparatus of claim 1 , wherein the exhaustion mechanism comprises an exhaustion hose connected to a via hole formed in the cap, and a vacuum pump for sucking out the air via the exhaustion hose.

6 . The Joule heat encapsulating apparatus of claim 1 , wherein the power applying mechanism comprises an electrode member attached to the cap so as to contact the electric current application wiring, and a power source connected to the electrode member.

7 . The Joule heat encapsulating apparatus of claim 6 , wherein a plurality of the electric current application wirings are formed, and a plurality of electrode members are formed in correspondence to the plurality of electric current application wirings.

8 . The Joule heat encapsulating apparatus of claim 1 , wherein a plurality of the electric current application wirings are formed, and a plurality of electrode members are formed in correspondence to the plurality of electric current application wirings.

9 . The Joule heat encapsulating apparatus of claim 1 , further comprising a pressing unit formed on the cap for pressing the panel so that the cap is adhered to the stage.

10 . A Joule heat encapsulating method, comprising the steps of:

mounting a panel on a stage, the panel including a thermal-hardening type sealant for surrounding and sealing a display unit formed between a first substrate and a second substrate, a heat-generating wiring overlapping the thermal-hardening type sealant, and an electric current application wiring connected to the heat-generating wiring;

forming a sealed space, in which the panel is arranged, between the stage and a cap by covering the stage with the cap;

exhausting air in the sealed space; and

hardening the thermal-hardening type sealant by supplying a current to the heat-generating wiring via the electric current application wiring.

11 . The Joule heat encapsulating method of claim 10 , further comprising maintaining the sealed space airtight by interposing a sealing member which is elastically pressed between the stage and the cap.

12 . The Joule heat encapsulating method of claim 11 , wherein the sealing member comprises one of a silicon O-ring and a cellular rubber O-ring.

13 . The Joule heat encapsulating method of claim 10 , further comprising the step of pressing the panel so that the cap is adhered to the stage by using a pressing unit formed on the cap.

Assignments (2)
MERGER Recorded Sep 21, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029241/0599 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 13, 2011
From: KWON, OH-SEOB; KOH, SUNG-SOO; PARK, DONG-SEOP; RO, JAE-SANG; LEE, SEONG-YOUNG; HONG, WON-EUI
To: SAMSUNG MOBILE DISPLAY CO., LTD., A CORPORATION CHARTERED IN AND EXISTING UNDER THE LAWS OF THE REPUBLIC OF KOREA; ENSIL TECH CO., LTD. A CORPORATION CHARTERED IN AND EXISTING UNDER THE LAWS OF THE REPUBLIC OF KOREA
Reel/Frame 026501/0471 →